5SGXMA3E2H29C3N

The 5SGXMA3E2H29C3N is a Stratix® V GX Field Programmable Gate Array (FPGA) IC from Intel, delivered in a 780-BBGA (FCBGA) surface-mount package. It provides a high-density programmable fabric with a large on-chip memory and an extensive I/O complement for complex system integration.

With approximately 340,000 logic elements, approximately 19.456 Mbits of embedded memory and 600 I/Os, this device targets designs that require significant logic capacity, substantial embedded RAM, and broad external interfacing in a commercial temperature grade (0 °C to 85 °C).

Key Features

• Core logic capacity  Approximately 340,000 logic elements for high-density programmable logic integration.
• Embedded memory  Approximately 19.456 Mbits of on-chip RAM to support buffering, state storage, and data-path operations.
• I/O density  600 I/Os to support complex multi-channel interfacing and system-level connectivity.
• Package and mounting  780-BBGA (FCBGA) surface-mount package; supplier device package listed as 780-HBGA (33×33) for board-level design considerations.
• Power domain  Core voltage supply specified at 820 mV to 880 mV for power-domain planning and supply sequencing.
• Temperature and grade  Commercial grade device with an operating range of 0 °C to 85 °C.
• Environmental compliance  RoHS compliant.
• Series documentation  Stratix V device electrical and switching characteristics (series datasheet) are provided for detailed operating and timing specifications.

Unique Advantages

• High integration density: Large logic element count reduces the need for multiple discrete devices and simplifies board-level design.
• Substantial on-chip memory: Approximately 19.456 Mbits of embedded RAM enables significant local buffering and state storage, minimizing external memory dependency.
• Extensive external interfacing: 600 I/Os allow flexible, high-concurrency connections to peripherals, sensors, and parallel interfaces.
• Board-level packaging options: 780-BBGA (FCBGA) and a 33×33 HBGA supplier package provide clear mechanical and thermal integration paths for compact, high-density layouts.
• Defined power envelope: Tight core supply window (820 mV–880 mV) supports refined power delivery network design for predictable operation.
• Commercial temperature suitability: Specified 0 °C to 85 °C operating range for designs targeting commercial-environment deployments.

Why Choose 5SGXMA3E2H29C3N?

The 5SGXMA3E2H29C3N provides a combination of high logic density, substantial embedded memory, and a large I/O count in a standardized 780-BBGA package, making it suitable for system designs that require consolidated programmable resources and broad external connectivity. As a member of the Stratix V GX family, it aligns with the series-level electrical and switching characteristics documented in the Stratix V device datasheet.

For design teams prioritizing integration density, precise power-domain planning, and RoHS-compliant commercial-grade operation, this FPGA delivers verifiable specifications to support hardware architecture and board-level implementation decisions.

Request a quote or submit an inquiry to obtain pricing, availability, and technical documentation for the 5SGXMA3E2H29C3N.