5SGXMA3E2H29I2L

The 5SGXMA3E2H29I2L is an Intel Stratix® V GX field programmable gate array (FPGA) supplied in a 780‑ball BGA/FCBGA package. It delivers high logic capacity and dense I/O for demanding industrial designs requiring large programmable logic fabrics and substantial on‑chip memory.

This device is positioned for designs that need significant programmable resources—340,000 logic elements, approximately 19.456 Mbits of embedded memory, and up to 600 I/O—while operating across an industrial temperature range and a low‑voltage core supply.

Key Features

• High Logic Capacity  340,000 logic elements to implement large-scale digital designs and complex custom logic.
• Embedded Memory  Approximately 19.456 Mbits of on‑chip RAM for data buffering, FIFOs, and on‑chip storage.
• Large I/O Count  Up to 600 user I/O pins to support broad interfacing requirements and high pin‑count connectivity.
• Transceiver Capability (Stratix V GX Series)  Stratix V GX family devices include high‑speed transceiver options (series documentation lists GX channel speeds up to 14.1 Gbps), enabling high‑rate serial links where applicable.
• Low‑Voltage Core  Core supply range of 820 mV to 880 mV for the device core domain.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C for industrial deployment.
• Package & Mounting  Supplied in a 780‑BBGA, FCBGA package; supplier device package listed as 780‑HBGA (33x33). Surface mount mounting type.
• Regulatory  RoHS compliant.

Typical Applications

• High‑density logic integration  Implement complex state machines, custom datapaths, and large combinatorial/sequential logic using 340,000 logic elements and extensive embedded memory.
• High‑speed serial connectivity  Leverage Stratix V GX transceiver capabilities (documented GX channel speeds up to 14.1 Gbps) for multi‑Gbps serial links and packet‑based interfaces.
• Industrial systems  Industrial temperature rating (−40 °C to 100 °C) and 600 I/O make the device suitable for robust industrial control, instrumentation, and communications equipment.

Unique Advantages

• Substantial programmable fabric  Large logic capacity enables integration of multiple subsystems on a single device, reducing board count and interconnect complexity.
• Significant on‑chip memory  Approximately 19.456 Mbits of embedded RAM supports buffering, packet processing, and data‑intensive logic without relying solely on external memory.
• High I/O density  600 I/O pins provide flexibility for parallel interfaces, wide buses, or mixed signal domain connectivity.
• Industrial durability  Wide operating temperature range and RoHS compliance address industrial deployment requirements and environmental considerations.
• Low‑voltage core operation  Core supply range of 820–880 mV aligns with modern low‑voltage designs and power‑domain planning.
• Compact BGA package options  780‑ball BGA/FCBGA (supplier: 780‑HBGA (33x33)) enables high‑density PCB layouts while maintaining surface‑mount assembly compatibility.

Why Choose 5SGXMA3E2H29I2L?

The 5SGXMA3E2H29I2L brings a combination of large programmable logic, substantial embedded memory, and extensive I/O in a single Stratix V GX device suited to industrial environments. Its documented Stratix V electrical and switching characteristics support high‑performance designs that require both logic density and high‑speed serial capability.

This device is a fit for engineering teams designing scalable, high‑integration systems that must operate across wide temperature ranges and adhere to RoHS requirements. Detailed electrical and timing information is available in the device datasheet for system validation and integration planning.

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