5SGXMA3E2H29I2WN

The 5SGXMA3E2H29I2WN is an Intel Stratix® V GX field programmable gate array (FPGA) device delivering high logic density and large embedded memory in a 780-BBGA FCBGA package. Built for industrial-grade applications, this device integrates 340,000 logic elements, approximately 19.456 Mbits of on-chip RAM, and 600 user I/Os to address complex, high‑I/O designs.

As a Stratix V GX device, the part is offered within the Stratix V family and supports the series’ documented transceiver speed grades and electrical characteristics for high-performance system designs that require robust I/O and on-chip resources.

Key Features

• Core Logic  340,000 logic elements provide substantial on-chip programmable logic for large-scale digital designs.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM to support buffering, on-chip data structures, and high-throughput processing.
• High I/O Count  600 user I/Os accommodate extensive external interfacing and multi-channel connectivity requirements.
• High‑speed Transceiver Support  Stratix V GX devices include transceiver speed grades documented in the device family; the series lists GX channel options up to 14.1 Gbps per channel in the datasheet.
• Power and Voltage  Core voltage supply range specified at 870 mV to 930 mV to match system power-rail design requirements.
• Package and Mounting  780-BBGA (FCBGA) package; supplier device package noted as 780-HBGA (33×33). Device is surface-mount for standard PCB assembly processes.
• Industrial Temperature Grade  Rated for operation from –40 °C to 100 °C for deployment in industrial environments.
• Regulatory  RoHS compliant.

Typical Applications

• High-speed communications and networking  High logic density, substantial embedded RAM, and Stratix V GX transceiver capabilities make the device suitable for packet processing, line cards, and protocol engines.
• Signal processing and acceleration  Large on-chip memory and extensive logic resources support real-time DSP pipelines and hardware acceleration tasks.
• Industrial control and automation  Industrial temperature rating and high I/O count enable complex control systems, multi-sensor aggregation, and deterministic I/O interfacing.

Unique Advantages

• High logic capacity: 340,000 logic elements enable implementation of large, integrated FPGA designs without partitioning across multiple devices.
• Significant on-chip memory: Approximately 19.456 Mbits of embedded RAM reduces dependence on external memory for buffering and working data sets.
• Extensive I/O integration: 600 user I/Os provide flexible connectivity to peripherals, high‑speed interfaces, and multi-channel systems.
• Industrial robustness: Operation from –40 °C to 100 °C supports deployment in demanding environmental conditions.
• Packaging for high-density boards: 780-BBGA FCBGA (780-HBGA 33×33) surface-mount packaging fits high-density PCB layouts while enabling the device’s pinout count.
• Standards‑aware supply: RoHS compliance aligns with common environmental and manufacturing requirements.

Why Choose 5SGXMA3E2H29I2WN?

The 5SGXMA3E2H29I2WN balances high logic density, substantial embedded memory, and a large I/O budget in an industrial-grade Stratix V GX FPGA package. It targets designs that need on-chip capacity for complex algorithms and abundant external interfacing while operating across extended temperature ranges.

This part is suited to engineering teams building high-throughput communications equipment, real-time signal processing accelerators, or industrial control systems that require scalable logic resources, significant embedded RAM, and a broad set of I/Os within a compact surface-mount package.

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