5SGXMA3E2H29I3LG

The 5SGXMA3E2H29I3LG is an Intel Stratix V GX FPGA offered in a 780-BBGA, FCBGA package (supplier package: 780-HBGA, 33x33). This industrial-grade, surface-mount device provides 340,000 logic elements, approximately 19.456 Mbits of embedded memory, and up to 600 user I/Os.

Designed for designs that require high logic density, large on-chip RAM, and broad I/O capability, the Stratix V family also includes high-speed transceiver options—documented in the device datasheet with GX channel speeds up to 14.1 Gbps depending on speed grade. The device operates from a core supply range of 820 mV to 880 mV and across an industrial temperature range of -40 °C to 100 °C.

Key Features

• Core Logic  340,000 logic elements to implement high-density digital logic, state machines, and datapaths.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM for buffering, FIFOs, and large on-chip datasets.
• I/O Capacity  Up to 600 general-purpose I/Os for extensive board-level connectivity and parallel interfaces.
• High-Speed Transceivers (Series Capability)  Stratix V GX devices include transceiver options with GX channel speeds up to 14.1 Gbps in some speed grades, as detailed in the Stratix V device datasheet.
• Power  Core voltage supply range from 820 mV to 880 mV to match system power-rail requirements.
• Package & Mounting  780-BBGA, FCBGA package; supplier device package 780-HBGA (33x33). Surface-mount mounting type for standard PCB assembly flows.
• Temperature & Grade  Industrial grade with specified operating range from -40 °C to 100 °C.
• Environmental Compliance  RoHS compliant.

Typical Applications

• High-performance communications & networking  Leverages large logic capacity and family transceiver capabilities for line cards, switches, and packet-processing engines.
• Data and signal processing  Embedded memory and dense logic resources support DSP pipelines, real-time data aggregation, and accelerator functions.
• Industrial control & instrumentation  Industrial temperature rating and broad I/O count enable robust control systems, motion control, and precision instrumentation.
• System integration & prototyping  High logic and I/O densities make this device suitable for integrating complex system functions and validating SoC-level designs.

Unique Advantages

• High logic density: 340,000 logic elements enable implementation of large-scale state machines and complex algorithms on a single device, reducing board-level partitioning.
• Substantial on-chip memory: Approximately 19.456 Mbits of embedded RAM reduces external memory dependence for mid-sized buffering and on-chip storage.
• Extensive I/O: Up to 600 user I/Os allow flexible interfacing to multiple peripherals, buses, and parallel I/O domains without additional GPIO expanders.
• Industrial operating range: -40 °C to 100 °C rating supports deployment in demanding environments where thermal resilience is required.
• Flexible packaging: 780-ball BGA footprint in a surface-mount form factor supports standard PCB assembly while providing high pin-count connectivity.
• Standards-aligned documentation: Device and family details are documented in the Stratix V device datasheet, including available transceiver speed grades for system planning.

Why Choose 5SGXMA3E2H29I3LG?

The 5SGXMA3E2H29I3LG positions itself as a high-density, industrial-grade Stratix V GX FPGA option for designs that require a balance of logic capacity, embedded memory, and a large number of I/Os. Its surface-mount 780-ball BGA package and specified core voltage range make it suitable for tightly integrated, power-conscious system boards.

Engineers targeting communications, data processing, and industrial control applications will find the combination of logic elements, on-chip RAM, and family-level transceiver capabilities useful for consolidating functionality into a single FPGA, simplifying board-level design and enabling scalable deployments backed by the Stratix V documentation.

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