5SGXMA3E2H29I3N

The 5SGXMA3E2H29I3N is a Stratix V GX field programmable gate array (FPGA) from Intel, targeted at designs that require large programmable logic capacity, extensive I/O, and significant on-chip memory. This device provides a high-density FPGA fabric with specifications suited to industrial-grade deployments.

Key device-level attributes include 340,000 logic elements, approximately 19.456 Mbits of total on-chip RAM, 600 I/O pins, a low-voltage core supply range of 820 mV to 880 mV, and an industrial operating temperature range of −40 °C to 100 °C. The device is supplied in a 780-BBGA FCBGA package and is RoHS compliant.

Key Features

• Core and Logic 340,000 logic elements (logic cells) for implementing large-scale programmable designs.
• Embedded Memory Approximately 19.456 Mbits of total on-chip RAM to support data buffering, state storage, and local memory requirements.
• I/O Capacity 600 I/O pins to interface with multiple peripherals, high-pin-count mezzanines, or large connector arrays.
• Power Supply Core voltage supply range from 820 mV to 880 mV to match system power architectures that require low-voltage FPGA cores.
• Package & Mounting 780-BBGA (FCBGA) package; supplier device package listed as 780-HBGA (33×33), surface-mount mounting type for PCB integration.
• Temperature & Grade Industrial grade operation with an ambient operating temperature range of −40 °C to 100 °C.
• Compliance RoHS compliant, meeting standard environmental requirements for lead-free assembly.

Unique Advantages

• High-capacity programmable fabric: 340,000 logic elements enable complex logic integration and large FPGA designs without external logic expansion.
• Substantial on-chip memory: Approximately 19.456 Mbits of embedded RAM reduces dependence on external memory for many buffering and algorithmic needs.
• Extensive I/O count: 600 I/Os provide flexibility for dense system interfaces, multiple peripherals, and high-pin-count board layouts.
• Industrial temperature rating: −40 °C to 100 °C operation supports deployment in environments requiring extended temperature tolerance.
• BGA packaging for compact boards: 780-BBGA / 780-HBGA (33×33) packaging allows high-pin-density integration in space-constrained PCB designs.
• RoHS compliant: Meets lead-free manufacturing requirements for regulatory and environmental considerations.

Why Choose 5SGXMA3E2H29I3N?

The 5SGXMA3E2H29I3N combines large logic capacity, significant embedded memory, and a high I/O count in an industrial-grade Stratix V GX device. These characteristics make it suitable for designs that demand on-chip resources and broad interfacing capability while maintaining a compact BGA form factor.

For projects that require scalable programmable logic, extensive local RAM, and robust ambient temperature operation, this Intel Stratix V GX FPGA offers a specification set tailored to complex, resource-intensive designs.

Request a quote or submit an inquiry to obtain pricing, lead time, and availability for the 5SGXMA3E2H29I3N.