5SGXMA3E3H29C2L

The 5SGXMA3E3H29C2L is a Stratix® V GX Field Programmable Gate Array (FPGA) from Intel (Altera). This commercial-grade, surface-mount FPGA delivers high logic density, substantial on-chip RAM, and a large I/O complement in a 780-ball BGA package.

Designed for applications that require significant logic capacity and on-chip memory, the device combines 340,000 logic elements with approximately 19.456 Mbits of embedded RAM and up to 600 I/Os, while operating from a core supply range of 820 mV to 880 mV.

Key Features

• Core density 340,000 logic elements provide high integration for complex digital designs and large gate-count implementations.
• Embedded memory Approximately 19.456 Mbits of on-chip RAM for data buffering, FIFOs, and state storage within the FPGA fabric.
• I/O capacity Up to 600 user I/Os to support wide parallel interfaces, multiple peripherals, and extensive board-level connectivity.
• Power supply Core operating voltage range of 820 mV to 880 mV, enabling operation at the device's specified low-voltage core levels.
• Package and mounting 780-ball BGA (FCBGA / 780-HBGA supplier package, 33 × 33 mm) for surface-mount board assembly and high-density PCB layouts.
• Operating temperature and grade Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Regulatory RoHS compliant.

Unique Advantages

• High integration density: 340,000 logic elements reduce the need for multi-device implementations and simplify system partitioning.
• Substantial on-chip memory: Approximately 19.456 Mbits of embedded RAM supports large data buffers and state machines without external memory.
• Extensive I/O resources: 600 I/Os enable broad interface support and parallel connectivity for complex systems.
• Compact BGA packaging: 780-ball FCBGA (33 × 33 mm) supports high-density PCB routing while maintaining a surface-mount assembly profile.
• Commercial-grade operation: Specified for 0 °C to 85 °C, meeting typical commercial environment requirements.
• Standards-compliant materials: RoHS compliance supports environmentally conscious design and manufacturing processes.

Why Choose 5SGXMA3E3H29C2L?

The 5SGXMA3E3H29C2L is positioned for designs that require a combination of large logic capacity, significant on-chip RAM, and broad I/O availability in a commercial-temperature FPGA. Its low-voltage core range and high-density BGA package make it suitable for compact, high-functionality boards where integration and on-chip resources matter.

Detailed electrical and switching characteristics for Stratix V devices, including operating conditions and power considerations, are documented in the Stratix V device datasheet provided by Altera/Intel, enabling engineers to assess timing, power, and I/O behavior for system integration and long-term design planning.

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