5SGXMA3E3H29C2LG

The 5SGXMA3E3H29C2LG is a Stratix V GX Field Programmable Gate Array offering a high-density fabric and extensive I/O capability. This commercial-grade, surface-mount FPGA provides 340,000 logic elements, approximately 19.456 Mbits of embedded memory, and up to 600 I/Os, enabling complex digital designs that require significant logic and memory resources.

Device-level electrical and switching characteristics for the Stratix V family are documented in the device datasheet; the Stratix V GX series includes transceiver-capable devices and multiple commercial speed grades as described in the datasheet.

Key Features

• Logic Capacity — 340,000 logic elements for implementing large-scale digital logic and complex state machines.
• Embedded Memory — Approximately 19.456 Mbits of on-chip RAM to support buffers, FIFOs, and local memory structures.
• I/O Count — Up to 600 I/Os to accommodate dense board-level connectivity and multi-channel interfaces.
• Power/Core Supply — Specified core voltage range from 820 mV to 880 mV for proper device operation within defined electrical limits.
• Package & Mounting — 780-ball BBGA FCBGA package (supplier device package: 780-HBGA, 33 × 33) designed for surface-mount assembly.
• Commercial Temperature Grade — Rated for 0 °C to 85 °C operation, appropriate for commercial-temperature applications.
• Standards Compliance — RoHS compliant.
• Stratix V Family Characteristics — Series datasheet documents electrical and switching characteristics, I/O timing, and transceiver speed-grade options for Stratix V GX devices.

Typical Applications

• High-density digital systems — Implement complex logic, large state machines, and custom processors that require significant logic element counts.
• Memory-intensive designs — Use the device’s embedded RAM for buffering, packet buffering, and local data storage.
• High-I/O connectivity — Support boards and modules that require dozens to hundreds of general-purpose I/Os or parallel interfaces.

Unique Advantages

• Significant on-chip logic — 340,000 logic elements reduce reliance on external logic for complex functions and partitioning.
• Substantial embedded memory — Approximately 19.456 Mbits of RAM enables local data handling and reduces external memory bandwidth needs.
• High I/O availability — 600 I/Os provide flexibility for multi-channel interfaces and board integration without multiplexing compromises.
• Commercial-grade thermal range — Rated 0 °C to 85 °C for designs targeting commercial environments.
• Surface-mount BBGA packaging — 780-ball FCBGA/ HBGA package supports high-pin-count layouts in a compact footprint.
• RoHS compliant — Meets lead-free environmental requirements for commercial production.

Why Choose 5SGXMA3E3H29C2LG?

The 5SGXMA3E3H29C2LG places high logic density, substantial embedded memory, and broad I/O availability into a single commercial-grade Stratix V GX FPGA package. It is suited to projects that demand a compact, surface-mount solution with the capacity to implement complex digital designs and heavy on-chip buffering.

With documented electrical and switching characteristics in the Stratix V device datasheet and RoHS compliance, this device is positioned for commercial applications where performance, integration density, and supply-chain conformity are important considerations.

Request a quote or submit an inquiry to obtain pricing and availability for the 5SGXMA3E3H29C2LG for your next design.