5SGXMA3E3H29C2WN

The Intel Stratix V GX Field Programmable Gate Array, part number 5SGXMA3E3H29C2WN, is a commercial-grade FPGA supplied in a 780-BBGA FCBGA surface-mount package. It provides substantial on-chip resources including approximately 340,000 logic elements and approximately 19.456 Mbits of embedded memory to support large-scale digital implementations.

With up to 600 I/Os, a core voltage supply range of 870 mV to 930 mV, and a commercial operating temperature range of 0°C to 85°C, this device is targeted at designs requiring high logic capacity, dense connectivity, and compact board-level integration while meeting RoHS requirements.

Key Features

• Core Logic Approximately 340,000 logic elements for implementing complex digital logic and system functions.
• Embedded Memory Approximately 19.456 Mbits of on-chip RAM for buffering, state storage, and data-intensive operations.
• I/O Density 600 I/Os to support extensive peripheral interfacing and parallel data paths.
• Power Core voltage supply range 870 mV to 930 mV to suit low-voltage FPGA power domains.
• Package & Mounting 780-BBGA, FCBGA package (supplier device package: 780-HBGA 33×33) in a surface-mount form factor for high pin density and compact board footprint.
• Operating Conditions Commercial-grade temperature range 0°C to 85°C; RoHS-compliant.

Typical Applications

• High-density digital designs For implementations that require approximately 340,000 logic elements and substantial on-chip memory.
• Multi-I/O systems Suitable for designs that need up to 600 I/Os to interface with multiple peripherals or parallel buses.
• Compact system integration Designed for board-level applications that benefit from a 780-BBGA surface-mount package and RoHS compliance.

Unique Advantages

• Large on-chip logic capacity: Approximately 340,000 logic elements reduce the need to split complex designs across multiple devices.
• Substantial embedded memory: Approximately 19.456 Mbits of RAM enables local buffering and tight coupling with logic to simplify data handling.
• High I/O count: 600 I/Os support dense connectivity without external I/O expansion.
• Compact, high-density package: 780-BBGA (780-HBGA 33×33) provides a small board footprint while delivering large pin count.
• Commercial temperature and RoHS compliance: Rated 0°C to 85°C and RoHS-compliant for commercial product assemblies.

Why Choose 5SGXMA3E3H29C2WN?

The 5SGXMA3E3H29C2WN Stratix V GX FPGA offers a balance of large logic capacity, embedded memory, and high I/O density in a compact surface-mount package. Its commercial temperature rating and RoHS compliance make it a practical option for commercial product development and system integration that demand consolidated on-chip resources and dense board-level connectivity.

This device is suitable for engineering teams and procurement professionals building complex digital systems that require significant internal resources, a high number of I/Os, and a compact board footprint.

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