5SGXMA3E3H29C4G

The 5SGXMA3E3H29C4G is a Stratix® V GX family FPGA in a 780-BBGA (FCBGA) package designed for high-density, programmable logic integration. It provides a large logic fabric and significant on-chip memory with extensive I/O capability for complex digital systems.

This commercial-grade device targets applications that require high logic capacity, substantial embedded memory, and broad I/O counts while operating within standard commercial temperature and voltage envelopes.

Key Features

• Logic Capacity  340,000 logic elements to implement large-scale digital designs and custom hardware functions.
• Embedded Memory  Approximately 19.46 Mbits of embedded memory for large buffering, state storage, and on-chip data processing.
• I/O Density  600 user I/Os to support wide parallel interfaces, high pin-count subsystems, and rich external connectivity.
• Package & Mounting  780‑BBGA (FCBGA) package; supplier device package 780‑HBGA (33×33); surface-mount mounting type for board-level integration.
• Power Supply  Core voltage supply range of 820 mV to 880 mV to match system power-rail planning and decoupling requirements.
• Commercial Temperature Grade  Rated for 0 °C to 85 °C operation for commercial-environment deployments.
• RoHS Compliant  Meets RoHS requirements for reduced hazardous substances in manufacturing.

Typical Applications

• High-density digital systems  Use the large logic resource pool to implement complex state machines, datapaths, and custom accelerators.
• Real-time data buffering and processing  Embedded memory and abundant I/O enable on-chip buffering and preprocessing for streaming data applications.
• Multi-interface integration  High I/O count supports aggregation of many external interfaces and parallel peripheral buses on a single device.
• Prototyping and system validation  Programmability combined with substantial resources makes the device suitable for iterative hardware development and validation of large designs.

Unique Advantages

• Substantial logic resources: 340,000 logic elements allow implementation of large, high-function-count designs without external glue logic.
• On-chip memory for throughput: Approximately 19.46 Mbits of embedded memory reduces dependence on external RAM for many buffering and caching needs.
• High I/O count for system-level integration: 600 I/Os provide the flexibility to connect multiple peripherals, sensors, and high-bandwidth interfaces directly to the FPGA.
• Compact, board-ready package: 780‑BBGA (33×33) surface-mount package supports dense PCB layout while maintaining robust connectivity.
• Commercial-grade operating window: Designed for 0 °C to 85 °C operation with a defined core voltage range, simplifying system power and thermal design for commercial products.
• RoHS compliance: Facilitates compliance with environmental and manufacturing requirements.

Why Choose 5SGXMA3E3H29C4G?

The 5SGXMA3E3H29C4G delivers a combination of high logic density, significant embedded memory, and extensive I/O in a single commercial-grade Stratix V GX FPGA. Its specifications make it appropriate for engineers building complex digital systems that require on-chip resources to minimize external components and streamline system architecture.

Designed for scalable, high-capacity designs, this device is well-suited to teams needing a programmable, high-density platform with clear electrical and package parameters for integration into commercial applications.

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