5SGXMA3E3H29C3N

The 5SGXMA3E3H29C3N is a Stratix V GX family FPGA from Intel, offered in a 780-ball BGA surface-mount package. It delivers very high logic capacity and abundant I/O for complex system designs.

With approximately 340,000 logic elements, about 19.456 Mbits of embedded memory and 600 I/Os, this commercial-grade device (0 °C to 85 °C) is suited to high-density designs that require significant on-chip resources and extensive external connectivity. The device uses a core supply range of 820 mV to 880 mV and is RoHS compliant.

Key Features

• High Logic Density  Approximately 340,000 logic elements to implement complex logic and custom silicon functions on-chip.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM for buffering, state machines and local storage without relying on external memory.
• Extensive I/O  600 available I/Os to support broad interfacing and multiple parallel buses or lanes.
• Package & Mounting  780-BBGA (FCBGA) package; supplier device package listed as 780-HBGA (33×33). Surface-mount mounting type for compact PCB integration.
• Power  Core voltage supply specified from 820 mV to 880 mV to aid power budgeting and regulator selection.
• Commercial Temperature Grade  Operating range 0 °C to 85 °C suitable for commercial applications.
• Standards Compliance  RoHS compliant.
• Family Documentation  Part of the Stratix V device family with detailed electrical and switching characteristics provided in the Stratix V device datasheet.

Typical Applications

• High-density logic systems  Large-scale custom logic implementations that benefit from high logic element counts and embedded memory.
• High-I/O embedded platforms  Systems that require many external interfaces or parallel connections leveraging the 600 I/Os.
• On-chip buffering and data staging  Use of the device’s embedded RAM for data buffering, FIFOs and intermediate storage in streaming or packet-based designs.

Unique Advantages

• High integration density: Approximately 340,000 logic elements and ~19.456 Mbits of embedded memory reduce dependence on external logic and RAM.
• Broad external connectivity: 600 I/Os simplify integration with multiple peripherals, interfaces and parallel buses.
• Compact BGA footprint: 780-ball BGA package (33×33) enables dense PCB layouts while supporting a large device pinout.
• Predictable power envelope: Core voltage specified between 820 mV and 880 mV facilitates regulator and thermal planning.
• Commercial readiness: Rated for 0 °C to 85 °C operation for deployments in commercial environments.
• RoHS compliant: Conforms to RoHS requirements for environmentally compliant manufacturing.

Why Choose 5SGXMA3E3H29C3N?

The 5SGXMA3E3H29C3N positions itself as a high-capacity Stratix V GX FPGA option for designs needing significant on-chip logic, memory and I/O. Its combination of approximately 340,000 logic elements, roughly 19.456 Mbits of embedded RAM and 600 I/Os supports complex, connectivity-rich implementations in a commercial-temperature, surface-mount BGA package.

Choose this device when your design requires large on-chip resources, extensive external interfacing and documented electrical and switching characteristics available through the Stratix V device documentation.

Request a quote or submit an inquiry for availability and pricing to begin evaluating the 5SGXMA3E3H29C3N for your next design.