5SGXMA3E3H29C4N

The 5SGXMA3E3H29C4N is a Stratix® V GX Field Programmable Gate Array (FPGA) IC from Intel, offered in a 780-BBGA FCBGA package with a 33×33 supplier package footprint. It provides high device density with 340,000 logic elements and approximately 19.456 Mbits of embedded memory, combined with 600 general-purpose I/Os for designs that require large programmable logic capacity and substantial I/O connectivity.

Built for commercial-temperature applications, this device operates from 0 °C to 85 °C and is RoHS compliant. The device’s documented electrical and switching characteristics are covered in the Stratix V device datasheet.

Key Features

• Logic Capacity  340,000 logic elements (cells) to support large, complex digital designs and dense logic implementations.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM for buffering, lookup tables, and memory-intensive logic functions.
• I/O Density  600 I/O pins to enable extensive external device interfacing and parallel connectivity.
• Package & Mounting  780-BBGA FCBGA package (supplier device package: 780-HBGA, 33×33) with surface-mount mounting type for high-density PCB integration.
• Power Supply  Core voltage range specified at 820 mV to 880 mV, enabling designs that target this supply window.
• Commercial Grade & Temperature  Commercial-grade device with an operating temperature range of 0 °C to 85 °C.
• Standards Compliance  RoHS compliant, supporting environmentally regulated designs.
• Family Documentation  Electrical and switching characteristics for Stratix V devices, including I/O timing and transceiver information, are documented in the Stratix V device datasheet.

Typical Applications

• High-density digital systems  Use the device’s 340,000 logic elements and substantial embedded RAM to implement complex state machines, datapaths, and hardware-accelerated functions.
• Data-plane and packet processing  600 I/Os provide the connectivity needed for high-port-count interfaces and parallel I/O architectures commonly used in networking equipment.
• Signal processing and compute acceleration  Large on-chip memory and logic capacity support buffering, pipelined processing, and custom accelerator blocks.

Unique Advantages

• High logic density: 340,000 logic elements allow integration of multiple functions onto a single device, reducing board-level component count.
• Substantial embedded memory: Approximately 19.456 Mbits of RAM for on-chip data storage and efficient local buffering without external memory.
• Extensive I/O: 600 I/Os enable flexible partitioning of signals, parallel interfaces, and complex external connectivity.
• Compact surface-mount package: 780-BBGA (33×33) package supports high-density PCB layouts while providing the pin-count required for complex systems.
• Commercial temperature suitability: Rated for 0 °C to 85 °C environments for mainstream commercial electronic applications.
• Environmental compliance: RoHS compliance supports regulatory requirements for material restrictions.

Why Choose 5SGXMA3E3H29C4N?

The 5SGXMA3E3H29C4N positions itself as a high-capacity Stratix V GX FPGA for commercial applications that demand significant programmable logic, embedded memory, and a high I/O count in a compact 780-BBGA package. Its documented Stratix V device characteristics make it suitable for designers who require detailed electrical and timing guidance during system development.

This device is appropriate for teams building complex digital systems, data-plane accelerators, or signal-processing hardware that benefit from on-chip memory and abundant I/O. Backed by the Stratix V family documentation, it supports disciplined design and integration workflows.

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