5SGXMA3E2H29I3G

The 5SGXMA3E2H29I3G is a Stratix V GX Field Programmable Gate Array (FPGA) featuring 340,000 logic elements and approximately 19.456 Mbits of embedded memory. It is offered in an industrial temperature grade and supplied in a 780-BBGA (FCBGA) package with a 33 × 33 HBGA footprint.

Key device-level characteristics include up to 600 I/O pins, a core supply voltage range of 820 mV to 880 mV, surface-mount packaging, and an operating temperature range of −40 °C to 100 °C. Electrical and transceiver characteristics for the Stratix V family are documented in the device datasheet.

Key Features

• Core capacity — 340,000 logic elements and 128,300 LABs provide substantial programmable fabric for complex designs.
• Embedded memory — approximately 19.456 Mbits of on-chip RAM for buffering, state storage, and DSP support.
• I/O density — 600 I/O pins for extensive external interfacing and system integration.
• Power — core supply voltage specified from 820 mV to 880 mV to match system power domains.
• Package & mounting — 780-BBGA, FCBGA package (supplier device package: 780‑HBGA, 33×33) with surface-mount assembly.
• Temperature & grade — industrial grade with an operating range of −40 °C to 100 °C; RoHS compliant.
• Stratix V GX family transceiver information — transceiver speed grades for the Stratix V family are specified in the device datasheet (example GX channel speeds are listed in the family documentation).

Typical Applications

• High-speed data transport and protocol bridging — the Stratix V family transceiver specifications (documented in the datasheet) support high-rate serial interfaces suitable for data transport and bridging tasks.
• Digital signal processing and algorithm acceleration — large logic capacity and substantial on-chip memory enable implementation of DSP pipelines and custom accelerators.
• I/O‑intensive system controllers — 600 I/Os accommodate multiple peripherals, interfaces, and board-level connections in a single device.
• Industrial control and automation — industrial grade temperature range (−40 °C to 100 °C) and robust packaging make the device suitable for demanding industrial environments.

Unique Advantages

• High logic density: 340,000 logic elements and 128,300 LABs allow consolidation of large designs into a single FPGA, reducing component count.
• Significant on-chip memory: approximately 19.456 Mbits of embedded RAM supports buffering, state machines, and data-intensive functions without external memory.
• Extensive I/O count: 600 I/Os simplify board-level integration and reduce the need for multiplexing or external expanders.
• Industrial-grade operation: specified for −40 °C to 100 °C operation, aligning with industrial application requirements.
• High-pin-count package: 780-BBGA (780‑HBGA, 33×33) supports high I/O and power delivery in a surface-mount form factor.
• Environmental compliance: RoHS compliant for lead‑free assembly and regulatory alignment.

Why Choose 5SGXMA3E2H29I3G?

The 5SGXMA3E2H29I3G positions itself as a high-capacity Stratix V GX FPGA for designs that require large programmable logic resources, substantial embedded memory, and a high I/O count within an industrial-grade package. Its documented family-level transceiver specifications and device electrical parameters make it appropriate for systems that demand integrated digital processing and extensive external interfacing.

This device is suited to engineers and system designers building industrial, communications, or data‑centric applications that benefit from high logic density, on-chip memory, and a robust package that supports surface-mount assembly and industrial temperature operation.

Request a quote or submit an inquiry for part 5SGXMA3E2H29I3G to obtain pricing and availability information tailored to your project needs.