5SGXMA3E2H29I2LG

The 5SGXMA3E2H29I2LG is an Intel Stratix V GX field programmable gate array supplied in a 780-ball FCBGA package. It delivers high on-chip integration with 340,000 logic elements and approximately 19.456 Mbits of embedded memory for complex digital designs.

Designed for industrial-grade applications, this device offers up to 600 user I/O pins and support for Stratix V GX family transceiver speed grades (as documented in the Stratix V device datasheet), making it suitable for high-density logic, memory-intensive processing, and high-speed I/O implementations.

Key Features

• Logic Capacity — 340,000 logic elements and 128,300 logic array blocks provide large programmable fabric for complex functions and parallel processing.
• Embedded Memory — Approximately 19.456 Mbits of on-chip RAM to support buffering, large state machines, and data-path storage.
• I/O Count — 600 user I/O pins to support wide parallel interfaces, multiple memory channels, and dense peripheral connectivity.
• Package and Mounting — 780-ball BGA FCBGA package; supplier lists 780-HBGA (33×33) variant; surface-mount device suitable for PCB assembly.
• Power Supply — Core voltage specified between 820 mV and 880 mV to match platform power design requirements.
• Temperature Range — Industrial-rated operation from −40 °C to 100 °C for robust operation in demanding environments.
• Standards and Compliance — RoHS compliant.
• Series Capabilities (per datasheet) — Stratix V GX family includes transceiver speed grades that support high-speed serial channel operation per the Stratix V device datasheet.

Typical Applications

• High-speed serial interfacing — Leverage the Stratix V GX family transceiver speed grades for designs that require multi-gigabit serial links.
• Large-scale logic integration — Implement complex state machines, protocol offloads, and custom accelerators using 340,000 logic elements and abundant embedded RAM.
• High-density I/O systems — 600 I/O pins enable wide parallel buses, multi-channel data acquisition, and dense peripheral connectivity.

Unique Advantages

• High integration density: Large logic and memory capacity reduces the need for external components and simplifies system architecture.
• Industrial operating range: −40 °C to 100 °C rating supports reliable operation across a wide temperature range.
• Extensive I/O resources: 600 user I/Os allow flexible interface options and support for complex board-level designs.
• Package options for board-level design: 780-ball FCBGA packaging with surface-mount mounting supports standard PCB assembly processes.
• Controlled core supply window: 820 mV–880 mV core voltage specification aids predictable power delivery and thermal planning.
• RoHS compliance: Meets common environmental requirements for modern electronics manufacturing.

Why Choose 5SGXMA3E2H29I2LG?

The 5SGXMA3E2H29I2LG combines substantial logic capacity, significant on-chip memory, and a large I/O complement in an industrial-grade Stratix V GX FPGA package. It is positioned for designs that require dense programmable logic, high-bandwidth I/O, and the thermal and environmental margins expected in industrial applications.

For engineering teams building high-performance digital systems, communications interfaces, or hardware accelerators, this device offers the scalability and integration needed to reduce system complexity while retaining flexibility for future iterations.

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