5SGXMA3E2H29I2N

The 5SGXMA3E2H29I2N is a Stratix V GX Field Programmable Gate Array (FPGA) IC from Intel, offered in an industrial temperature grade. It delivers very-high logic capacity and extensive I/O in a ball-grid array package, making it suited for designs that require dense programmable logic, significant on-chip memory, and large peripheral connectivity.

Key device attributes include approximately 340,000 logic elements, roughly 19.456 Mbits of embedded memory, and 600 user I/Os, enabling integration of complex digital functions while maintaining a compact surface-mount package profile.

Key Features

• Core Logic  Approximately 340,000 logic elements to implement large-scale programmable logic and complex RTL designs.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM to support buffer storage, FIFOs, and memory‑intensive algorithms.
• I/O Capacity  600 user I/Os to support dense peripheral and high-pin-count interfaces.
• Package and Mounting  780-BBGA (FCBGA) package, supplier device package 780-HBGA (33×33); surface-mount mounting for compact board integration.
• Power  Core supply voltage range 870 mV to 930 mV for defined low-voltage operation.
• Industrial Temperature Grade  Rated for operation from −40°C to 100°C for deployment in industrial environments.
• Regulatory  RoHS compliant.

Typical Applications

• High-density FPGA designs  Use the 340,000 logic elements and 600 I/Os to consolidate multiple digital functions into a single programmable device.
• Memory‑intensive processing  Approximately 19.456 Mbits of embedded RAM supports buffering and local data storage for signal processing and packet handling.
• Industrial systems  Industrial temperature grade (−40°C to 100°C) and surface-mount BGA package suit a range of industrial control and automation applications.

Unique Advantages

• High logic density: Enables implementation of complex logic and large state machines within a single FPGA, reducing system BOM.
• Large I/O complement: 600 I/Os accommodate extensive peripheral interfacing without external I/O expanders.
• Substantial on-chip memory: Nearly 19.456 Mbits of embedded RAM reduces reliance on external memory for many buffering and storage needs.
• Compact BGA package: 780-ball FCBGA (33×33) provides high pin count in a compact, surface-mount form factor for dense board layouts.
• Industrial operating range: −40°C to 100°C rating supports deployment in demanding environmental conditions.
• RoHS compliant: Meets common lead‑free manufacturing requirements.

Why Choose 5SGXMA3E2H29I2N?

The 5SGXMA3E2H29I2N positions itself as a high-capacity, industrial-grade Stratix V GX FPGA ideal for designs that require large programmable logic resources, abundant I/O, and substantial embedded memory in a compact BGA package. Its specified core voltage range and industrial temperature rating make it appropriate for robust, long‑running systems where on-board integration density and reliability are priorities.

As part of the Stratix V device family, this FPGA provides a clear upgrade path within a well-documented device family and is appropriate for engineering teams focused on scaling complex digital designs while managing board area and component count.

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