5SGXMA3E2H29I2G

IC FPGA 600 I/O 780HBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 19456000 340000 780-BBGA, FCBGA

Quantity 585 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package780-HBGA (33x33)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case780-BBGA, FCBGANumber of I/O600Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs128300Number of Logic Elements/Cells340000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits19456000

Overview of 5SGXMA3E2H29I2G – Stratix® V GX FPGA, 340,000 Logic Elements, 600 I/Os

The 5SGXMA3E2H29I2G is a Stratix® V GX field programmable gate array (FPGA) IC designed to deliver large programmable logic capacity and extensive I/O capability in a compact FCBGA package. Built on the Stratix V GX architecture, the device pairs 340,000 logic elements with approximately 19.456 Mbits of embedded RAM to address complex digital designs that require high logic density and sizable on-chip memory.

With a 600-pin I/O count, industrial temperature grading, and defined operating supply range, this device targets demanding embedded and industrial applications that require robust thermal and electrical operating margins.

Key Features

  • Core Logic  340,000 logic elements provide a large programmable fabric for complex control, signal processing, and custom logic implementations.
  • Embedded Memory  Approximately 19.456 Mbits of on-chip RAM supports large buffering, packet handling, and state storage without external memory dependency.
  • I/O Density  600 I/O pins enable broad peripheral and interface support for high-pin-count boards and multi-channel systems.
  • Package  780-BBGA (FCBGA) supplier device package: 780-HBGA (33×33) offers a high-density BGA footprint for space-constrained designs.
  • Power  Core voltage supply range of 870 mV to 930 mV gives defined operating headroom for core power planning and regulator selection.
  • Temperature & Grade  Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in extended-temperature environments.
  • Compliance  RoHS-compliant construction to support regulatory and manufacturing requirements.
  • Stratix V GX Series Characteristics  Part of the Stratix V GX family, which includes high-speed transceiver options and industrial/commercial speed grades (as defined in the Stratix V device documentation).

Typical Applications

  • High-density digital processing  Use the 340,000 logic elements and substantial embedded RAM for complex state machines, DSP pipelines, and hardware-accelerated algorithms.
  • High-pin-count interface systems  The 600 available I/Os accommodate multi-protocol interfaces, parallel buses, and extensive sensor/actuator connectivity.
  • Industrial and embedded systems  Industrial-grade temperature rating (−40 °C to 100 °C) supports deployment in industrial control, monitoring, and automation equipment.
  • High-speed serial and connectivity  As a Stratix V GX device, it aligns with series capabilities for high-speed transceiver operation as documented for the Stratix V family.

Unique Advantages

  • Large programmable fabric: 340,000 logic elements enable consolidation of multiple functions into a single device, reducing board-level complexity.
  • Significant on-chip memory: Approximately 19.456 Mbits of embedded RAM reduces reliance on external memory and improves system determinism.
  • Extensive I/O connectivity: 600 I/Os provide flexibility to interface with numerous peripherals, sensors, or parallel data channels.
  • Industrial temperature capability: Rated for −40 °C to 100 °C to support extended-temperature deployment without additional thermal qualification statements.
  • High-density BGA package: 780-BBGA (33×33 HBGA) balances routing density and board-area efficiency for compact system designs.
  • Regulatory readiness: RoHS compliance facilitates environmentally conscious manufacturing and sourcing.

Why Choose 5SGXMA3E2H29I2G?

The 5SGXMA3E2H29I2G combines a substantial logic resource and large embedded memory with high I/O density and industrial temperature rating, positioning it for demanding embedded and industrial digital designs. Its Stratix V GX lineage and defined electrical characteristics make it suitable for teams that need to integrate complex logic, significant buffering, and broad peripheral connectivity into a single FPGA package.

This configuration is appropriate for development teams and product designers seeking a robust, high-density FPGA solution with predictable power and thermal requirements and the supportability that comes from documented Stratix V GX device specifications.

Request a quote or submit an inquiry to get pricing and availability details for the 5SGXMA3E2H29I2G and discuss how it can fit your next design.

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