5SGXMA3E2H29I2G
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 19456000 340000 780-BBGA, FCBGA |
|---|---|
| Quantity | 585 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 780-HBGA (33x33) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA, FCBGA | Number of I/O | 600 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 128300 | Number of Logic Elements/Cells | 340000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 19456000 |
Overview of 5SGXMA3E2H29I2G – Stratix® V GX FPGA, 340,000 Logic Elements, 600 I/Os
The 5SGXMA3E2H29I2G is a Stratix® V GX field programmable gate array (FPGA) IC designed to deliver large programmable logic capacity and extensive I/O capability in a compact FCBGA package. Built on the Stratix V GX architecture, the device pairs 340,000 logic elements with approximately 19.456 Mbits of embedded RAM to address complex digital designs that require high logic density and sizable on-chip memory.
With a 600-pin I/O count, industrial temperature grading, and defined operating supply range, this device targets demanding embedded and industrial applications that require robust thermal and electrical operating margins.
Key Features
- Core Logic 340,000 logic elements provide a large programmable fabric for complex control, signal processing, and custom logic implementations.
- Embedded Memory Approximately 19.456 Mbits of on-chip RAM supports large buffering, packet handling, and state storage without external memory dependency.
- I/O Density 600 I/O pins enable broad peripheral and interface support for high-pin-count boards and multi-channel systems.
- Package 780-BBGA (FCBGA) supplier device package: 780-HBGA (33×33) offers a high-density BGA footprint for space-constrained designs.
- Power Core voltage supply range of 870 mV to 930 mV gives defined operating headroom for core power planning and regulator selection.
- Temperature & Grade Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in extended-temperature environments.
- Compliance RoHS-compliant construction to support regulatory and manufacturing requirements.
- Stratix V GX Series Characteristics Part of the Stratix V GX family, which includes high-speed transceiver options and industrial/commercial speed grades (as defined in the Stratix V device documentation).
Typical Applications
- High-density digital processing Use the 340,000 logic elements and substantial embedded RAM for complex state machines, DSP pipelines, and hardware-accelerated algorithms.
- High-pin-count interface systems The 600 available I/Os accommodate multi-protocol interfaces, parallel buses, and extensive sensor/actuator connectivity.
- Industrial and embedded systems Industrial-grade temperature rating (−40 °C to 100 °C) supports deployment in industrial control, monitoring, and automation equipment.
- High-speed serial and connectivity As a Stratix V GX device, it aligns with series capabilities for high-speed transceiver operation as documented for the Stratix V family.
Unique Advantages
- Large programmable fabric: 340,000 logic elements enable consolidation of multiple functions into a single device, reducing board-level complexity.
- Significant on-chip memory: Approximately 19.456 Mbits of embedded RAM reduces reliance on external memory and improves system determinism.
- Extensive I/O connectivity: 600 I/Os provide flexibility to interface with numerous peripherals, sensors, or parallel data channels.
- Industrial temperature capability: Rated for −40 °C to 100 °C to support extended-temperature deployment without additional thermal qualification statements.
- High-density BGA package: 780-BBGA (33×33 HBGA) balances routing density and board-area efficiency for compact system designs.
- Regulatory readiness: RoHS compliance facilitates environmentally conscious manufacturing and sourcing.
Why Choose 5SGXMA3E2H29I2G?
The 5SGXMA3E2H29I2G combines a substantial logic resource and large embedded memory with high I/O density and industrial temperature rating, positioning it for demanding embedded and industrial digital designs. Its Stratix V GX lineage and defined electrical characteristics make it suitable for teams that need to integrate complex logic, significant buffering, and broad peripheral connectivity into a single FPGA package.
This configuration is appropriate for development teams and product designers seeking a robust, high-density FPGA solution with predictable power and thermal requirements and the supportability that comes from documented Stratix V GX device specifications.
Request a quote or submit an inquiry to get pricing and availability details for the 5SGXMA3E2H29I2G and discuss how it can fit your next design.

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