5SGXMA3E2H29C2LG

The 5SGXMA3E2H29C2LG is a Stratix® V GX family FPGA delivering high on-chip logic and memory density in a surface-mount BGA package. It provides 340,000 logic elements with approximately 19.456 Mbits of embedded memory and up to 600 I/Os, targeting complex digital designs that require substantial programmable fabric and I/O connectivity.

Designed as a commercial-grade device (0 °C to 85 °C) with a low-voltage core supply range (820 mV–880 mV), this part is suitable for demanding FPGA implementations where integration density and a comprehensive datasheet-driven design flow are important.

Key Features

• Core logic density — 340,000 logic elements and 128,300 LABs/CLBs provide the logic resources needed for large-scale digital designs.
• Embedded memory — Approximately 19.456 Mbits of on-chip RAM for implementing buffers, FIFOs, and state storage without external SRAM.
• I/O capacity — Up to 600 user I/Os to support wide parallel interfaces and multiple high-pin-count peripherals.
• Power and operating range — Core voltage supply range of 820 mV to 880 mV and commercial operating temperature rating from 0 °C to 85 °C.
• Package and mounting — Surface-mount 780-BBGA (FCBGA) package; supplier device package listed as 780-HBGA (33×33) for compact, high-pin-count board integration.
• Standards and documentation — Part of the Stratix V GX family; electrical and switching characteristics, including transceiver and I/O timing guidance, are documented in the Stratix V device datasheet.
• Environmental compliance — RoHS-compliant manufacturing status.

Typical Applications

• Network and communications systems — High logic density and large I/O count support packet-processing, protocol handling, and wide bus interfaces.
• Compute and acceleration modules — Large embedded memory and abundant logic elements enable custom accelerators and data-path implementations.
• Video and image processing — On-chip RAM and extensive logic resources allow buffering, pipeline processing, and parallel compute for video pipelines.
• High-density I/O controllers — Up to 600 user I/Os for bridging, aggregation, and multi-channel interface applications.

Unique Advantages

• Substantial programmable fabric: 340,000 logic elements give designers the capacity to implement large, complex systems within a single device.
• Significant embedded memory: Approximately 19.456 Mbits of on-chip RAM reduces dependence on external memory for many buffering and storage tasks.
• High I/O count: 600 user I/Os simplify board-level integration of multiple interfaces and parallel data paths.
• Compact, manufacturable package: 780-BBGA (780-HBGA, 33×33) surface-mount packaging balances high pin count with PCB assembly considerations.
• Commercial-grade operating range: Specified for 0 °C to 85 °C operation and RoHS compliance for mainstream electronic applications.
• Datasheet-backed design guidance: The Stratix V device documentation provides the electrical and switching characteristics needed for robust implementation and verification.

Why Choose 5SGXMA3E2H29C2LG?

The 5SGXMA3E2H29C2LG is positioned for designers who need large-scale programmable resources, ample embedded memory, and extensive I/O in a single commercial-grade FPGA. Its combination of 340,000 logic elements, approximately 19.456 Mbits of on-chip RAM, and 600 I/Os makes it well suited to complex communications, compute acceleration, and high-density I/O applications.

Backed by the Stratix V GX family datasheet and documented electrical characteristics, this device supports an engineering-driven design flow where integration density and clear, datasheet-defined operating parameters are priorities.

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