5SGXMA3E1H29C2LN

The 5SGXMA3E1H29C2LN is a Stratix V GX Field Programmable Gate Array (FPGA) in a 780-BBGA FCBGA package, offered as a commercial-grade device. It provides high logic capacity, substantial on-chip memory, and a large I/O count for complex, I/O-dense FPGA designs.

Key device-level parameters include 340,000 logic elements, approximately 19.5 Mbits of embedded RAM, 600 I/Os, and a core supply range of 820 mV to 880 mV. The device is RoHS compliant and specified for commercial operating temperatures (0 °C to 85 °C).

Key Features

• Core Logic  340,000 logic elements provide substantial fabric resources for large-scale logic integration and custom hardware acceleration.
• On-chip Memory  Approximately 19.5 Mbits of embedded RAM to support buffering, look-up tables, and data-intensive processing on-chip.
• I/O Density  600 user I/Os to support complex board-level interfacing and high pin-count peripheral connectivity.
• Transceiver Family  Stratix V GX-class transceivers: the device family supports GX channel speeds described in the datasheet (up to 14.1 Gbps depending on speed grade).
• Power and Supply  Core supply range of 820 mV to 880 mV to match modern low-voltage power architectures.
• Package and Mounting  780-BBGA (FCBGA) package; supplier device package listed as 780-HBGA (33 × 33). Surface-mount mounting type for standard PCB assembly.
• Commercial Temperature Grade  Specified operating range of 0 °C to 85 °C for commercial applications.
• Regulatory Compliance  RoHS compliant for reduced hazardous substances.

Typical Applications

• I/O-dense system designs  Large I/O count supports complex board-level connectivity where many external interfaces are required.
• High-capacity logic implementations  The high logic element count enables complex custom algorithms and parallel processing blocks on a single device.
• On-chip data buffering and storage  Approximately 19.5 Mbits of embedded RAM for intermediate buffering, packet handling, and state storage without external memory.

Unique Advantages

• High integration density: 340,000 logic elements reduce the need for multiple devices by consolidating large logic designs into a single FPGA.
• Substantial embedded memory: Approximately 19.5 Mbits of on-chip RAM supports memory-hungry functions and reduces external memory dependency.
• Extensive I/O availability: 600 I/Os provide flexibility for complex interfacing and multi-protocol designs.
• Family-level transceiver capability: Stratix V GX transceiver options (family supports up to 14.1 Gbps depending on speed grade) enable high-speed serial link possibilities as defined in the device family documentation.
• Commercial-ready specification: Designed for commercial temperature ranges (0 °C to 85 °C) and RoHS compliance for regulatory alignment.
• Surface-mount 780-BBGA package: Compact FCBGA packaging (780 balls, supplier package 33 × 33) suitable for standard PCB assembly processes.

Why Choose 5SGXMA3E1H29C2LN?

The 5SGXMA3E1H29C2LN offers a combination of high logic capacity, significant embedded memory, and a large I/O complement in a commercial-grade Stratix V GX FPGA. It is well suited for complex, I/O-intensive designs that require substantial on-chip resources and the packaging options of a 780-BBGA FCBGA device.

For design teams seeking scalable logic and memory resources with Stratix V GX family characteristics and clear commercial-temperature specifications, this device delivers a verifiable, high-capacity FPGA option backed by the device-level electrical and timing specifications contained in the Stratix V documentation.

Request a quote or submit an inquiry for pricing and availability to move your design forward with the 5SGXMA3E1H29C2LN.