5SGXMA3H3F35C2WN

The 5SGXMA3H3F35C2WN is a Stratix® V GX Field Programmable Gate Array (FPGA) from Intel, offered in a 1152‑ball BGA (35 × 35 mm) package with surface‑mount mounting. It delivers a high‑density programmable fabric with 340,000 logic elements and approximately 19.456 Mbits of embedded memory, making it suitable for complex custom digital implementations.

This commercial‑grade device supports a wide I/O count and a low core voltage domain (870 mV to 930 mV), and is RoHS‑compliant. Family datasheet material for Stratix V GX devices documents transceiver speed grades and core speed grades applicable within the series.

Key Features

• Core Logic  340,000 logic elements suitable for large-scale custom logic designs and complex state machines.
• Embedded Memory  Approximately 19.456 Mbits of on‑chip RAM for buffering, lookup tables, and local data storage.
• I/O Capacity  600 I/O pins to support extensive external connectivity and multi‑lane interfaces.
• Power Supply  Core supply range 870 mV to 930 mV for the device core domain.
• Package & Mounting  1152‑BBGA (FCBGA) package, supplier device package listed as 1152‑FBGA (35×35), surface mount.
• Temperature & Grade  Commercial grade with operating temperature range 0 °C to 85 °C.
• Standards Compliance  RoHS‑compliant.
• Family Characteristics (Stratix V GX)  The Stratix V GX family documentation includes transceiver and core speed‑grade options for high‑speed serial channels (see family datasheet for details).

Typical Applications

• High‑density logic implementations  Use the 340,000 logic elements to realize large, custom digital functions and complex control logic.
• Memory‑intensive workloads  Approximately 19.456 Mbits of embedded RAM enables on‑chip buffering, FIFOs, and fast local storage for data‑heavy designs.
• I/O‑heavy systems  600 I/O pins provide broad external interfacing options for multi‑lane buses and peripheral connectivity.
• High‑speed serial applications (Stratix V GX family)  The Stratix V GX family datasheet documents high‑speed transceiver speed grades; consult the family documentation for transceiver capabilities and speed‑grade options.

Unique Advantages

• High programmable density: 340,000 logic elements let you consolidate multiple functions into a single device, reducing board‑level component count.
• Substantial on‑chip memory: Approximately 19.456 Mbits of embedded RAM reduces external memory dependency for many buffering and stateful applications.
• Extensive I/O: 600 I/Os simplify board routing for designs that require many external interfaces or parallel connections.
• Compact BGA packaging: 1152‑ball FCBGA (35×35 mm) provides a high I/O density in a surface‑mount form factor suitable for space‑constrained PCBs.
• Commercial temperature rating: Rated for 0 °C to 85 °C for applications targeting commercial environments.
• RoHS compliant: Environmentally compliant manufacturing and materials for global deployment.

Why Choose 5SGXMA3H3F35C2WN?

The 5SGXMA3H3F35C2WN positions itself as a high‑density, commercially graded FPGA option within the Stratix V GX family, combining hundreds of thousands of logic elements, multi‑megabit on‑chip RAM, and broad I/O capacity in a 1152‑ball BGA package. Its electrical parameters—compact form factor, low core voltage domain, and the documented family transceiver/core speed grade options—make it appropriate for designs that require dense programmable logic and significant on‑chip memory.

This device is suited to engineering teams and procurement looking for a Stratix V GX FPGA with high integration potential, well‑documented family characteristics, and RoHS compliance. For full device‑level electrical and switching characteristics, refer to the Stratix V device documentation.

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