5SGXMA3H3F35C3WN

The 5SGXMA3H3F35C3WN is a Stratix® V GX Field Programmable Gate Array (FPGA) IC from Intel, provided in a 1152‑BBGA FCBGA package. It offers very high logic density and substantial on‑chip memory and I/O resources targeted at complex digital designs that require large programmable logic capacity and extensive external interfacing.

This commercial‑grade device combines approximately 340,000 logic elements with about 19.456 Mbits of embedded memory and 600 user I/Os, making it suitable for large-scale FPGA implementations within the Stratix V family.

Key Features

• Core density  Approximately 340,000 logic elements to support large, complex logic designs and deep pipelining.
• Logic array capacity  128,300 LABs (logic array blocks) for structural partitioning and hierarchical design flows.
• Embedded memory  Approximately 19.456 Mbits of on‑chip RAM for buffering, FIFOs, and local data storage.
• I/O resources  600 general-purpose I/Os to accommodate wide external interfaces and multi‑lane connectivity.
• Power and core voltage  Core supply range 820 mV to 880 mV for devices designed to operate within a defined low‑voltage core envelope.
• Package and mounting  1152‑BBGA, FCBGA package (supplier device package: 1152‑FBGA, 35×35); surface mount device suitable for high‑density PCB assembly.
• Operating grade and temperature  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Regulatory compliance  RoHS compliant.

Typical Applications

• High‑density digital processing  With approximately 340,000 logic elements and ~19.456 Mbits of embedded memory, the device is suited to large signal‑processing pipelines and algorithm acceleration implemented on‑chip.
• Data aggregation and packet processing  Large I/O count (600) enables broad external connectivity for aggregation of high‑bandwidth interfaces and parallel data paths.
• Custom system integration  High logic and I/O resources support integration of multiple functions—control logic, protocol handling, and local buffering—within a single FPGA package.

Unique Advantages

• High logic capacity: Supports complex designs and large HDL codebases without immediate need for multiple devices.
• Substantial on‑chip memory: Approximately 19.456 Mbits of embedded RAM reduces dependence on external memory for many buffering and stateful functions.
• Extensive I/O availability: 600 user I/Os provide flexibility for wide parallel buses, multi‑lane interfaces, and numerous peripheral connections.
• Compact FCBGA package: 1152‑BBGA (35×35) allows dense placement on PCBs while delivering the device’s high resource count.
• Commercial temperature rating: Rated 0 °C to 85 °C for standard commercial deployments.
• RoHS compliant: Meets environmental regulatory requirements for lead‑free manufacturing flows.

Why Choose 5SGXMA3H3F35C3WN?

The 5SGXMA3H3F35C3WN delivers a combination of very high logic density, large embedded memory, and broad I/O availability in a compact 1152‑BBGA FCBGA package. As a member of the Stratix V GX family, it fits designs that require significant on‑chip resources for complex digital systems, high‑throughput data paths, and integrated multi‑function implementations. Its commercial temperature rating and RoHS compliance make it appropriate for mainstream product deployments that need a reliable, high‑capacity FPGA platform.

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