5SGXMA3K1F35I2G

The 5SGXMA3K1F35I2G is an Intel Stratix® V GX field-programmable gate array supplied in a 1152‑BBGA FCBGA package. It provides high-density reconfigurable logic with a large embedded memory footprint and extensive I/O for complex digital designs.

Built for industrial-grade deployments, this device combines 340,000 logic elements, approximately 19.456 Mbits of on-chip RAM, and up to 600 I/Os—delivering a platform suitable for high-channel I/O systems, dense logic integration, and designs that require extended operating temperature support.

Key Features

• Logic Density — 340,000 logic elements for implementing large-scale digital functions and complex custom processors.
• Embedded Memory — Approximately 19.456 Mbits of on-chip RAM to support buffering, lookup tables, and local data storage.
• High I/O Count — 600 available I/Os to support multi-channel interfaces, parallel buses, and extensive peripheral connectivity.
• Package & Mounting — 1152‑BBGA (FCBGA) supplier device package: 1152‑FBGA (35×35); surface-mount mounting type for compact board integration.
• Power Envelope — Core voltage specified at 870 mV to 930 mV to match system power-rail planning.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• RoHS Compliant — Conforms to RoHS requirements.
• Series-Level Transceiver Offering — Stratix V GX devices are offered in commercial and industrial speed grades with transceiver options (refer to the Stratix V datasheet for grade specifics).

Typical Applications

• High-density signal processing — Use the large logic element count and embedded RAM to implement FPGA-based DSP pipelines and custom accelerators.
• Multi‑channel interface hubs — Leverage 600 I/Os to aggregate and bridge numerous parallel and serial interfaces in a single device.
• Industrial control systems — Industrial temperature rating (−40 °C to 100 °C) and rugged packaging make it suitable for automation and control applications.
• System prototyping and integration — High logic capacity and memory allow rapid prototyping of complex SoC functions and system-level integration on a single FPGA.

Unique Advantages

• High logic integration: 340,000 logic elements reduce the need for multiple discrete FPGAs and simplify board-level design.
• Significant on-chip memory: Approximately 19.456 Mbits of embedded RAM supports deep buffering and local data storage without external memory.
• Large I/O footprint: 600 I/Os enable broad connectivity and flexibility for dense interface requirements.
• Industrial temperature capability: Rated from −40 °C to 100 °C for reliable operation in demanding environments.
• Compact FCBGA package: 1152‑BBGA (35×35) offers a space-efficient form factor for high-density system designs.
• Controlled core power: Core supply range of 870 mV to 930 mV provides clear power-rail requirements for system power planning.

Why Choose 5SGXMA3K1F35I2G?

The 5SGXMA3K1F35I2G delivers a balanced combination of high logic capacity, substantial on-chip memory, and an extensive I/O complement in a compact FCBGA package. Its industrial temperature rating and RoHS compliance make it a practical choice for applications that demand both performance and environmental robustness.

This device is well suited for engineers and system designers who need a single, high-density FPGA to consolidate functionality, reduce BOM complexity, and accelerate time-to-market for complex digital systems.

Request a quote or submit an inquiry to receive pricing, availability, and technical assistance for integrating the 5SGXMA3K1F35I2G into your next design.