5SGXMA3K1F40C1WN

The 5SGXMA3K1F40C1WN is a Stratix® V GX Field Programmable Gate Array (FPGA) offered in a 1517-BBGA FCBGA package. It delivers a high density of programmable logic and embedded memory with extensive I/O, intended for designs that require large on-chip capacity and high pin counts.

Key characteristics include 340,000 logic elements, approximately 19.456 Mbits of embedded memory, 600 I/O pins, and a surface-mount 1517-FBGA (40×40) package. The device is rated for commercial operating temperatures and RoHS compliant.

Key Features

• High Logic Density  340,000 logic elements provide significant programmable fabric for complex digital designs.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM to support large buffers, FIFOs, and memory-hungry algorithms.
• Extensive I/O  600 I/O pins enable dense interfacing to peripherals, mezzanine cards, and external memory or logic.
• Transceiver Family (GX)  Part of the Stratix V GX family, designed where high-speed serial connectivity and transceiver capabilities are required (refer to Stratix V GX device documentation for transceiver details).
• Power and Voltage  Core supply specified from 870 mV to 930 mV for defined core power delivery and stable operation.
• Package & Mounting  1517-BBGA (FCBGA) package, supplier device package 1517-FBGA (40×40), surface-mount for PCB integration.
• Operating Range & Grade  Commercial grade with operating temperature from 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant for lead-free manufacturing requirements.

Typical Applications

• High-density digital processing: Use the large logic capacity and embedded RAM to implement complex signal processing pipelines and custom compute engines.
• High-pin-count interfacing: Leverage 600 I/O pins for multi-device connectivity, dense sensor arrays, or parallel memory interfaces.
• Communications and networking systems: As a Stratix V GX device, it supports designs that require advanced serial connectivity and programmable logic for protocol handling and packet processing.

Unique Advantages

• Substantial on-chip resources: 340,000 logic elements combined with approximately 19.456 Mbits of embedded memory reduce the need for external logic and RAM, simplifying system design.
• Large I/O availability: 600 I/O pins provide flexibility for multiple interfaces and high-bandwidth parallel connections, minimizing external bridging components.
• Compact, manufacturable package: 1517-FBGA (40×40) surface-mount package supports high-density PCB layouts and standard assembly processes.
• Commercial temperature rating: Specified for 0 °C to 85 °C operation to match mainstream electronic product environments.
• Defined core voltage range: Narrow core supply window (870 mV–930 mV) for predictable power budgeting and supply design.
• RoHS compliance: Aligns with lead-free manufacturing and global environmental requirements.

Why Choose 5SGXMA3K1F40C1WN?

The 5SGXMA3K1F40C1WN places a high-capacity Stratix V GX FPGA into a compact FCBGA footprint, delivering a balance of abundant logic elements, substantial embedded memory, and very high I/O density for demanding digital designs. Its commercial-grade temperature range and RoHS compliance make it suitable for mainstream applications that require robust programmable logic and dense interfacing.

This device is suited to teams and projects that need to consolidate functionality into a single programmable device—reducing board-level complexity while retaining flexibility for iterative design and feature expansion. Refer to the Stratix V device documentation for complete electrical and transceiver specifications when integrating this part into systems.

Request a quote or submit an inquiry to purchase the 5SGXMA3K1F40C1WN and discuss availability and lead times for your next design.