5SGXMA3K1F40C2LN

The 5SGXMA3K1F40C2LN is a Stratix® V GX field-programmable gate array (FPGA) from Intel, delivered in a 1517-BBGA FCBGA surface-mount package. This device provides a high-density programmable logic fabric with 340,000 logic elements and extensive on-chip memory for complex digital designs.

Designed for commercial-grade applications, the device supports a core supply voltage range of 820 mV to 880 mV and an operating temperature range of 0 °C to 85 °C, making it suitable for a broad range of commercial embedded and system-level designs that require large logic capacity and high I/O counts.

Key Features

• Core capacity  Approximately 340,000 logic elements (cells) for high-density logic integration and complex function consolidation.
• Embedded memory  Approximately 19.456 Mbits of on-chip RAM to support buffering, state storage, and large data structures without external memory.
• I/O density  600 I/Os to accommodate wide external interfaces and parallel connectivity to peripherals and subsystems.
• Package & mounting  1517-BBGA (1517-FBGA, 40×40) FCBGA, surface-mount package for compact board-level integration.
• Power supply  Core operating voltage range of 820 mV to 880 mV to match target system power architectures.
• Commercial temperature grade  Rated for operation from 0 °C to 85 °C and offered as a commercial-grade device.
• Environmental compliance  RoHS compliant for regulated manufacturing and deployment environments.

Typical Applications

• High-density logic integration  Consolidate multiple digital functions into a single programmable device using the large logic fabric and abundant I/Os.
• On-chip buffering and data handling  Use the approximately 19.456 Mbits of embedded RAM for packet buffering, FIFOs, and other intermediate storage needs.
• I/O-heavy interfacing  Support wide parallel interfaces and multiple peripherals with 600 available I/Os.
• Compact board designs  Deploy in space-constrained systems with the 1517-FBGA 40×40 surface-mount package.

Unique Advantages

• Large programmable fabric: 340,000 logic elements enable integration of complex algorithms and multiple IP blocks on a single device, reducing component count.
• Significant embedded memory: Approximately 19.456 Mbits of on-chip RAM minimizes reliance on external memory for many buffering and storage tasks.
• High I/O availability: 600 I/Os provide flexibility for connecting multiple interfaces and parallel data paths without multiplexing compromises.
• Compact FCBGA package: The 1517-BBGA (1517-FBGA 40×40) surface-mount package supports dense PCB layouts while maintaining accessibility to a large number of signals.
• Commercial-grade operating range: Rated 0 °C to 85 °C and designed for commercial deployments where this temperature window is required.
• Regulatory readiness: RoHS compliance supports environmentally conscious manufacturing and product deployment.

Why Choose 5SGXMA3K1F40C2LN?

The 5SGXMA3K1F40C2LN combines substantial logic capacity, on-chip memory, and one of the highest I/O counts available in a single FCBGA package, making it well suited for commercial designs that require dense programmable logic and broad connectivity. Its commercial temperature rating and RoHS compliance make it appropriate for a wide range of commercial embedded and system-level applications.

Backed by Intel, this Stratix V GX device is targeted at design teams seeking to consolidate functions, reduce external BOM, and deploy a high-density FPGA in a compact surface-mount package while meeting defined voltage and temperature requirements.

Request a quote or submit a purchase inquiry today to evaluate the 5SGXMA3K1F40C2LN for your next high-density FPGA design.