5SGXMA3K1F40C2WN

The 5SGXMA3K1F40C2WN is a Stratix V GX family Field Programmable Gate Array packaged in a 1517-ball FCBGA. It is a commercial-grade, surface-mount FPGA designed for high-density logic integration and complex system interfacing.

With a large logic capacity, substantial on-chip memory, and a high I/O count, this device is targeted at applications that require extensive programmable logic, significant embedded RAM, and broad external connectivity while operating within commercial temperature limits.

Key Features

• Core Logic Capacity  Approximately 340,000 logic elements (LEs) to implement wide-ranging custom digital functions and complex datapaths.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage without external memory in many designs.
• High I/O Count  Up to 600 user I/O pins for extensive external interfacing and multi-channel connectivity.
• Package & Mounting  1517-ball BGA (FCBGA) package with surface-mount assembly; supplier package dimension listed as 1517-FBGA (40×40).
• Power and Voltage  Core supply range specified from 870 mV to 930 mV for the device core.
• Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C, suitable for commercial embedded systems.
• Standards Compliance  RoHS-compliant for environmental and manufacturing compliance.
• Stratix V GX Family Characteristics  Part of the Stratix V GX family; the family datasheet documents electrical and switching characteristics, I/O timing, and transceiver-related specifications for GX-class devices.

Typical Applications

• High-density programmable logic  Use the device where large logic resources are required to implement complex custom state machines, accelerators, or protocol engines.
• On-chip buffering and memory-intensive designs  Leverage approximately 19.456 Mbits of embedded RAM for data buffering, packet queues, and local storage.
• Multi‑I/O interfacing  Deploy in systems that require a high number of external connections—up to 600 I/Os—for sensors, peripherals, or multi-channel I/O expansion.
• Commercial embedded systems  Designed for devices and systems operating in commercial temperature ranges (0 °C to 85 °C) and surface-mount assembly processes.

Unique Advantages

• Large programmable fabric: The substantial logic element count enables dense implementation of custom logic and parallel processing architectures.
• Significant on-chip RAM: Approximately 19.456 Mbits of embedded memory reduces dependence on external RAM for many buffering and temporary-storage needs.
• Extensive external connectivity: Up to 600 I/Os allow broad system integration and support for multi-channel interfaces without immediate need for external multiplexing.
• Compact, manufacturable package: 1517-ball FCBGA surface-mount package supports high-pin-count designs while remaining compatible with standard PCB assembly flows.
• Low-voltage core operation: Core supply range of 870 mV–930 mV aligns with modern low-voltage power architectures for efficient core power delivery.
• RoHS compliant: Meets environmental compliance requirements for a wide range of commercial products.

Why Choose 5SGXMA3K1F40C2WN?

The 5SGXMA3K1F40C2WN delivers a combination of high logic density, a large pool of embedded RAM, and a very high I/O count in a commercial-temperature, surface-mount FCBGA package. These attributes make it suitable for demanding programmable-logic tasks where on-chip memory and extensive external connectivity are essential.

As a member of the Stratix V GX family, this device aligns with the electrical and switching characteristic guidance documented for the family, offering designers a predictable platform for scaling complex digital and system-level functions while maintaining compliance with commercial manufacturing and environmental standards.

Request a quote or submit an inquiry to receive pricing and availability information for the 5SGXMA3K1F40C2WN and to discuss how it fits your next high-density FPGA design.