5SGXMA3K1F40C2NCV

The 5SGXMA3K1F40C2NCV is a Stratix® V GX field-programmable gate array (FPGA) from Intel, delivered in a 1517-BBGA (FCBGA) package. This commercial-grade device integrates high-density programmable logic, substantial on-chip memory, and a large I/O count to support complex digital designs.

With 340,000 logic elements, approximately 19.456 Mbits of embedded memory, and up to 600 I/Os, this Stratix V GX device is suited to applications that require significant logic capacity, wide parallel interfacing, and flexible system integration while operating within a 0 °C to 85 °C commercial temperature range.

Key Features

• Logic Capacity  340,000 logic elements (cells) for implementing large-scale combinational and sequential designs.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM to support buffering, LUT-based storage, and local data structures.
• I/O Density  Up to 600 general-purpose I/Os to enable wide parallel interfaces and flexible board-level connectivity.
• Power and Core Supply  Core voltage supply range from 870 mV to 930 mV for the device core operating domain.
• Package and Mounting  1517-BBGA (FCBGA) package, supplier device package listed as 1517-FBGA (40×40), supplied in a surface-mount format.
• Temperature Grade  Commercial-grade operation with an operating temperature range of 0 °C to 85 °C.
• Regulatory Compliance  RoHS compliant.
• Stratix V GX Family Capabilities  As a Stratix V GX device, it is part of a family that includes high-speed transceiver options across defined speed grades (family-level transceiver capabilities are documented in the Stratix V device literature).

Typical Applications

• High-density digital processing  Implements large logic designs and datapaths using 340,000 logic elements and substantial on-chip RAM.
• Parallel I/O interfacing  Leverages up to 600 I/Os for wide buses, multi-lane sensor interfaces, or parallel peripherals.
• Custom accelerator fabrics  Acts as a programmable compute element where integrated logic and embedded memory are used to build application-specific accelerators.

Unique Advantages

• High logic density: 340,000 logic elements enable complex SoC-style implementations without offloading large portions of logic to external devices.
• Significant on-chip memory: Approximately 19.456 Mbits of embedded RAM reduces dependence on external memory for buffering and local storage.
• Extensive I/O capability: 600 I/Os provide design flexibility for parallel interfaces and high-pin-count board integration.
• Compact FCBGA package: 1517-BBGA (FCBGA) packaging supports a high-density board footprint while remaining surface-mount compatible.
• Commercial temperature operation: Rated for 0 °C to 85 °C, suitable for standard commercial environments and equipment.
• RoHS compliant: Meets lead-free and hazardous-substance compliance requirements for mainstream electronics manufacturing.

Why Choose 5SGXMA3K1F40C2NCV?

The 5SGXMA3K1F40C2NCV combines large-scale programmable logic, substantial embedded memory, and a high I/O count in a single Stratix V GX FCBGA package, delivering a highly integrated solution for complex digital designs. Its commercial temperature rating and RoHS compliance make it suitable for mainstream electronics applications that require robust logic capacity and flexible interfacing.

This device is appropriate for engineering teams building high-density processing, custom acceleration, or multi-channel I/O systems that benefit from on-chip resources and Intel’s Stratix V GX family architecture. The combination of core voltage range, packaging, and family-level transceiver capabilities supports scalable implementations within the documented operating parameters.

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