5SGXMA3K2F35C1WN

The 5SGXMA3K2F35C1WN is an Intel Stratix V GX field-programmable gate array supplied in a 1152-ball FCBGA package. This commercial-grade FPGA delivers high logic density and substantial embedded memory with a large I/O count, making it suitable for complex digital designs that require integration of large logic fabric and extensive I/O resources.

Designed for applications that demand significant on-chip resources and robust I/O connectivity, the device combines approximately 340,000 logic elements, roughly 19.46 Mbits of embedded RAM, and up to 600 user I/Os in a 35×35 1152-FBGA footprint.

Key Features

• Logic Capacity  Approximately 340,000 logic elements to implement large-scale digital functions and custom processing pipelines.
• Embedded Memory  Approximately 19.46 Mbits of on-chip RAM for frame buffering, packet buffering, lookup tables, and state storage.
• I/O Density  Up to 600 user I/Os to support wide parallel interfaces, multiple peripherals, and extensive routing to daughtercards or backplanes.
• Package & Mounting  1152-BBGA (FCBGA) supplier package in a 35×35 mm FBGA layout; surface-mount design for high-density PCB integration.
• Supply Voltage  Core supply range specified from 870 mV to 930 mV to meet the device’s core power requirements.
• Operating Temperature  Commercial temperature grade with an operating range of 0 °C to 85 °C for standard commercial environments.
• Compliance  RoHS compliant.
• Series-Level Transceiver Info  Stratix V GX series devices include multi-gigabit transceiver speed grades as described in the Stratix V device datasheet.

Typical Applications

• High-speed serial systems  Suitable for applications that leverage Stratix V GX transceiver capabilities in multi-gigabit channels as described in the series documentation.
• Network and communications equipment  Large logic capacity and high I/O count enable packet processing, switching logic, and interface aggregation.
• FPGA-based processing and accelerators  Substantial embedded RAM and logic resources support custom hardware accelerators, data path processing, and prototyping platforms.
• Board-level integration  1152-ball FCBGA package and surface-mount mounting simplify integration into high-density PCB designs and modules.

Unique Advantages

• High integration density: The combination of ~340k logic elements and ~19.46 Mbits of embedded RAM reduces the need for external logic and memory, simplifying system architecture.
• Extensive I/O capability: Up to 600 I/Os provide flexibility to connect numerous peripherals, wide buses, or multiple high-speed interfaces without additional bridging logic.
• Compact, production-ready package: 1152-BBGA (35×35) FCBGA package supports surface-mount assembly for compact, manufacturable designs.
• Commercial operating range: Rated for 0 °C to 85 °C, matching typical commercial deployment environments.
• Regulatory compliance: RoHS compliance helps meet environmental and manufacturing requirements.

Why Choose 5SGXMA3K2F35C1WN?

The 5SGXMA3K2F35C1WN delivers a combination of high logic density, substantial embedded memory, and very large I/O capacity in a compact 1152-ball FCBGA package. It is positioned for designers who need a commercial-grade Stratix V GX device that supports complex data-path implementations, broad peripheral connectivity, and board-level integration in production assemblies.

With Intel Stratix V family documentation available for series-level electrical and transceiver characteristics, this part is appropriate for development teams focused on scalable, high-resource FPGA designs where on-chip resources and I/O density drive design choices.

Request a quote or submit an availability inquiry to receive pricing, lead-time information, and to initiate ordering for part number 5SGXMA3K2F35C1WN.