5SGXMA3K2F35C2WN

The 5SGXMA3K2F35C2WN is a Stratix® V GX field-programmable gate array (FPGA) IC from Intel, delivered in a 1152-ball FCBGA package. It provides high logic capacity, substantial on-chip memory, and a large I/O count for complex, high-density FPGA designs.

Designed as a commercial-grade device, this Stratix V GX part targets applications that require significant programmable logic, extensive embedded RAM, and broad I/O connectivity while operating within standard commercial temperature and core-voltage ranges.

Key Features

• Logic capacity — 340,000 logic elements to implement large, complex digital designs; device data also reports 128,300 CLB units.
• Embedded memory — Approximately 19.5 Mbits of on-chip RAM for buffers, FIFOs, and memory-intensive logic functions.
• I/O density — 600 user I/Os to support high-pin-count interfaces and extensive external connectivity.
• Package and mounting — 1152-BBGA (FCBGA), supplier package 1152-FBGA (35×35); surface-mount device suitable for high-density board layouts.
• Power — Core supply voltage range from 870 mV to 930 mV for the FPGA core.
• Temperature grade — Commercial grade with an operating range of 0 °C to 85 °C.

Typical Applications

• High-density digital processing: Implement large-scale logic, custom datapaths, and protocol engines using the device’s high logic element count and embedded RAM.
• Multi-interface systems: Use the 600 I/Os to connect multiple peripherals, high-pin-count mezzanines, or parallel interfaces on a single FPGA.
• Networking and communications prototypes: Leverage the Stratix V GX family characteristics and high resource counts to prototype complex network functions and packet-processing logic.

Unique Advantages

• High programmable density: 340,000 logic elements enable consolidation of large functions into a single FPGA, reducing board-level complexity.
• Substantial on-chip RAM: Approximately 19.5 Mbits of embedded memory supports buffering, packet queues, and large working datasets without external memory.
• Large I/O count: 600 I/Os provide flexibility for multi-channel designs and high connector counts.
• Compact FCBGA package: 1152-ball FCBGA (35×35) supports dense board integration while keeping the device footprint predictable for system designers.
• Commercial operating range: 0 °C to 85 °C and defined core voltage range (0.87 V–0.93 V) make sourcing and power budgeting straightforward for commercial products.

Why Choose 5SGXMA3K2F35C2WN?

The 5SGXMA3K2F35C2WN positions itself as a high-capacity, commercial-grade Stratix V GX FPGA suited to design teams that need large programmable logic arrays, significant embedded memory, and a high I/O count in a single device. Its FCBGA package and defined voltage and temperature envelopes simplify system integration and power planning for commercial products.

Engineers designing complex digital systems, multi-interface platforms, or advanced communication prototypes will find the device’s combination of resources and package format well matched to high-density board designs and demanding logic requirements.

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