5SGXMA3K2F35C3WN

The 5SGXMA3K2F35C3WN is an Intel Stratix® V GX field-programmable gate array (FPGA) offered in a 1152-ball FCBGA package. It delivers high on-chip capacity with approximately 340,000 logic elements and roughly 19.456 Mbits of embedded memory, combined with a large I/O count for I/O‑dense designs.

Designed for commercial-grade applications, this device targets systems requiring substantial programmable logic, abundant I/Os, and compact surface-mount packaging, while operating within a 0 °C to 85 °C commercial temperature range.

Key Features

• Core Capacity  Approximately 340,000 logic elements provide broad programmable logic resources for complex algorithms and custom hardware acceleration.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM to support buffering, lookup tables, and state-machine implementations without external memory dependence.
• I/O Density  600 user I/Os enable high-pin-count connectivity for multi-channel interfaces, board-level routing flexibility, and parallel data paths.
• Power Supply Range  Core voltage operation specified from 820 mV to 880 mV to align with defined power-rail designs and power budgeting.
• Package & Mounting  1152-ball BGA FCBGA (supplier package: 1152-FBGA, 35×35) in a surface-mount form factor for compact PCB integration.
• Temperature & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C for standard commercial deployments.
• Standards Compliance  RoHS compliant, meeting common environmental requirements for lead‑free assembly.
• Stratix V GX Family Transceiver Options  Series documentation notes Stratix V GX devices offer GX transceiver channel speed grades (examples in family data include 14.1 Gbps and 12.5 Gbps channels across commercial and industrial grades), providing options for high-speed serial I/O in the Stratix V family.

Typical Applications

• High‑performance networking  Large logic capacity and high I/O count support packet processing, protocol offload, and multi-port interface aggregation in communication equipment.
• Data processing and acceleration  On-chip memory and extensive logic enable custom compute kernels and hardware acceleration for data‑intensive processing tasks.
• High‑density I/O systems  600 I/Os accommodate multi-channel sensor interfaces, board-to-board links, and parallel data capture in measurement and instrumentation platforms.
• Prototyping and system integration  Surface-mount FCBGA packaging with a high pin count makes the device suitable for prototype-to-production designs that require compact, high-capacity programmable logic.

Unique Advantages

• Large programmable fabric: Approximately 340,000 logic elements enable complex designs and extensive custom logic integration on a single device.
• Substantial on‑chip memory: Nearly 19.5 Mbits of embedded RAM reduces reliance on external memory and simplifies board-level memory architecture.
• High I/O count for flexible connectivity: 600 I/Os provide design freedom for multi-channel interfaces and dense signal routing.
• Compact surface-mount package: 1152-ball FCBGA (35×35) supports space-constrained PCBs while retaining high pin density.
• Commercial temperature suitability: Rated for 0 °C to 85 °C operation to match a wide range of commercial electronic products.
• RoHS compliance: Compatible with lead-free assembly processes and common environmental requirements.

Why Choose 5SGXMA3K2F35C3WN?

The 5SGXMA3K2F35C3WN combines a high logic element count, significant on-chip memory, and a large number of I/Os within a compact 1152-ball FCBGA package. Its specifications make it well suited for commercial designs that require substantial programmable logic capacity and I/O density in a surface-mount form factor.

This device is an option for engineers and system designers building I/O-dense, compute-heavy applications that benefit from integrated memory and extensive programmable resources, backed by Intel’s Stratix V family documentation and device-level electrical characteristics.

Request a quote or submit an inquiry to receive pricing, availability, and support information for 5SGXMA3K2F35C3WN and to discuss how this FPGA can fit your next design.