5SGXMA3K2F35I2G

The 5SGXMA3K2F35I2G is a Stratix V GX family FPGA from Intel, delivered in a high-density 1152-BBGA FCBGA package. It combines a large logic capacity with substantial on-chip memory and a high I/O count for demanding system designs.

Designed for industrial-grade applications, this device offers approximately 340,000 logic elements, around 19.456 Mbits of embedded memory, and up to 600 I/O pins, enabling complex digital integration where high logic density, memory, and connectivity are required.

Key Features

• Logic Capacity — Approximately 340,000 logic elements to implement large, compute-intensive designs and custom logic functions.
• On-chip Memory — Approximately 19.456 Mbits of embedded memory for buffering, state machines, and data storage directly on the FPGA fabric.
• I/O Density — 600 I/O pins to support wide parallel interfaces, multiple peripherals, and high-pin-count board-level connectivity.
• Power and Core Voltage — Core voltage supply range of 870 mV to 930 mV, enabling defined power-rail design and supply planning.
• Package — High-density 1152-BBGA, FCBGA package (supplier device package: 1152-FBGA (35×35)) for compact board integration with many signal connections.
• Temperature and Grade — Industrial temperature grade with an operating range of −40 °C to 100 °C for deployment in harsh environments.
• RoHS Compliance — Device is RoHS compliant.
• Series-level Transceiver Capability — Stratix V GX devices include GX transceiver speed grades documented in the Stratix V datasheet (series-level specification shows GX channel speeds up to 14.1 Gbps).

Typical Applications

• High-bandwidth communications and networking — Large I/O count and Stratix V GX series transceiver capabilities support multi-lane interfaces and high-throughput link aggregation.
• Data processing and acceleration — High logic density and sizable on-chip memory enable implementation of custom accelerators, packet processing, and compute pipelines.
• Telecom and infrastructure equipment — Industrial-grade temperature range and robust package make this FPGA suitable for telecommunication line cards, switches, and baseband systems.
• Prototyping and FPGA-based system integration — Dense logic and memory resources facilitate system-level prototyping and consolidation of multiple functions into a single device.

Unique Advantages

• High integration density: Approximately 340,000 logic elements and ~19.456 Mbits of embedded memory reduce the need for external ASICs or discrete logic, simplifying designs.
• Extensive I/O capability: 600 I/O pins provide flexibility for interfacing to multiple peripherals, parallel buses, and high-pin-count connectors.
• Industrial reliability: Rated for −40 °C to 100 °C operation and supplied in a robust FCBGA package suited to demanding environments.
• Defined core supply range: 870 mV to 930 mV core voltage window supports predictable power-rail design and thermal planning.
• Standards-based family documentation: Part of the Intel Stratix V GX family with supporting datasheet material for device characteristics and transceiver speed-grade information.

Why Choose 5SGXMA3K2F35I2G?

The 5SGXMA3K2F35I2G positions itself as a high-density Stratix V GX FPGA option for engineers who need substantial logic resources, embedded memory, and broad I/O in an industrial-grade package. Its combination of approximately 340,000 logic elements, roughly 19.456 Mbits of on-chip RAM, and 600 I/Os enables consolidation of complex functions and high-throughput interfaces on a single device.

Backed by Intel’s Stratix V documentation and supplied in a 1152-BBGA (1152-FBGA (35×35)) package, this part is suitable for system designs that require scalability, deterministic power planning, and operation across a wide temperature range.

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