5SGXMA3K2F35I2WN

IC FPGA 600 I/O 1152FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 19456000 340000 1152-BBGA, FCBGA

Quantity 536 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O600Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs128300Number of Logic Elements/Cells340000
Number of GatesN/AECCNOBSOLETEHTS CodeN/A
QualificationN/ATotal RAM Bits19456000

Overview of 5SGXMA3K2F35I2WN – Stratix® V GX FPGA, 340,000 logic elements, 600 I/Os, 1152‑BBGA

The 5SGXMA3K2F35I2WN is a Stratix V GX field programmable gate array (FPGA) IC offering a high-density logic fabric and extensive I/O in a 1152‑BBGA (35×35) FCBGA package. It targets industrial-grade applications that require large on-chip memory, substantial logic capacity, and flexible I/O counts.

With 340,000 logic elements and approximately 19.46 Mbits of embedded memory, this Stratix V GX device is designed to consolidate complex digital functions and high-channel-count interfaces while operating across a wide industrial temperature range and a low core voltage range for modern system integration.

Key Features

  • Core Logic  340,000 logic elements (cells) provide a large programmable fabric for implementing complex digital designs and parallel processing pipelines.
  • Embedded Memory  Approximately 19.46 Mbits of on-chip RAM to support buffering, lookup tables, and data-path storage without external memory in many designs.
  • I/O Capacity  600 available I/Os enable high channel counts for multi-protocol interfacing, high-density routing, and extensive system connectivity.
  • Stratix V GX Family Transceiver Options  As a Stratix V GX device, it is part of the GX family described in the datasheet, which includes defined transceiver speed grades for high-speed serial links.
  • Package & Mounting  1152‑BBGA, FCBGA (35×35) supplier device package; surface-mount mounting for compact board-level integration.
  • Power and Supply  Core supply operating range from 870 mV to 930 mV for compatibility with modern low-voltage power architectures.
  • Industrial Operating Range  Industrial grade device with operating temperature range of −40 °C to 100 °C for reliable operation in demanding environments.
  • Standards Compliance  RoHS compliant to support environmentally conscious manufacturing and regulatory requirements.

Typical Applications

  • High‑speed communications and networking  Use the Stratix V GX family transceiver capabilities together with 600 I/Os and large logic capacity for packet processing, protocol bridging, and line-card functions.
  • Data‑plane acceleration  Large logic and embedded memory enable offload of compute-intensive data-path tasks and hardware acceleration for throughput-critical workloads.
  • Industrial control and automation  Industrial temperature grade and extensive I/O counts make the device suitable for complex control systems, motor drives, and multi-sensor aggregation.
  • High‑channel I/O systems  Systems that require many parallel interfaces—such as video/video-over-IP front-ends, instrumentation, or multi-channel acquisition—benefit from the 600 I/O capability.

Unique Advantages

  • High integration density:  340,000 logic elements and ~19.46 Mbits of embedded RAM reduce the need for external components and simplify system architecture.
  • Extensive I/O headroom:  600 I/Os provide flexibility for multi-protocol interfacing, enabling consolidation of multiple functions onto a single device.
  • Industrial robustness:  Rated for −40 °C to 100 °C operation, supporting deployments in challenging thermal environments.
  • Compact board-level footprint:  1152‑BBGA FCBGA packaging delivers a high pin count in a compact package suitable for dense PCB designs.
  • Low-voltage core support:  870 mV to 930 mV core supply range aligns with modern power-rail designs for efficient system integration.

Why Choose 5SGXMA3K2F35I2WN?

The 5SGXMA3K2F35I2WN provides a robust balance of programmable logic capacity, embedded memory, and high I/O count in an industrial-grade Stratix V GX FPGA. Its specifications make it well suited to designs that require substantial on-chip resources, dense connectivity, and reliable operation across a wide temperature range.

For engineering teams building high-throughput communications hardware, data-plane accelerators, or complex industrial systems, this device offers a scalable hardware platform backed by the Stratix V GX family specifications and supported package options for compact, high-performance board designs.

Request a quote or submit a pricing inquiry to evaluate 5SGXMA3K2F35I2WN for your next design and to obtain availability and ordering information.

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