5SGXMA3K2F35I2WN
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 19456000 340000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 536 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 600 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 128300 | Number of Logic Elements/Cells | 340000 | ||
| Number of Gates | N/A | ECCN | OBSOLETE | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 19456000 |
Overview of 5SGXMA3K2F35I2WN – Stratix® V GX FPGA, 340,000 logic elements, 600 I/Os, 1152‑BBGA
The 5SGXMA3K2F35I2WN is a Stratix V GX field programmable gate array (FPGA) IC offering a high-density logic fabric and extensive I/O in a 1152‑BBGA (35×35) FCBGA package. It targets industrial-grade applications that require large on-chip memory, substantial logic capacity, and flexible I/O counts.
With 340,000 logic elements and approximately 19.46 Mbits of embedded memory, this Stratix V GX device is designed to consolidate complex digital functions and high-channel-count interfaces while operating across a wide industrial temperature range and a low core voltage range for modern system integration.
Key Features
- Core Logic 340,000 logic elements (cells) provide a large programmable fabric for implementing complex digital designs and parallel processing pipelines.
- Embedded Memory Approximately 19.46 Mbits of on-chip RAM to support buffering, lookup tables, and data-path storage without external memory in many designs.
- I/O Capacity 600 available I/Os enable high channel counts for multi-protocol interfacing, high-density routing, and extensive system connectivity.
- Stratix V GX Family Transceiver Options As a Stratix V GX device, it is part of the GX family described in the datasheet, which includes defined transceiver speed grades for high-speed serial links.
- Package & Mounting 1152‑BBGA, FCBGA (35×35) supplier device package; surface-mount mounting for compact board-level integration.
- Power and Supply Core supply operating range from 870 mV to 930 mV for compatibility with modern low-voltage power architectures.
- Industrial Operating Range Industrial grade device with operating temperature range of −40 °C to 100 °C for reliable operation in demanding environments.
- Standards Compliance RoHS compliant to support environmentally conscious manufacturing and regulatory requirements.
Typical Applications
- High‑speed communications and networking Use the Stratix V GX family transceiver capabilities together with 600 I/Os and large logic capacity for packet processing, protocol bridging, and line-card functions.
- Data‑plane acceleration Large logic and embedded memory enable offload of compute-intensive data-path tasks and hardware acceleration for throughput-critical workloads.
- Industrial control and automation Industrial temperature grade and extensive I/O counts make the device suitable for complex control systems, motor drives, and multi-sensor aggregation.
- High‑channel I/O systems Systems that require many parallel interfaces—such as video/video-over-IP front-ends, instrumentation, or multi-channel acquisition—benefit from the 600 I/O capability.
Unique Advantages
- High integration density: 340,000 logic elements and ~19.46 Mbits of embedded RAM reduce the need for external components and simplify system architecture.
- Extensive I/O headroom: 600 I/Os provide flexibility for multi-protocol interfacing, enabling consolidation of multiple functions onto a single device.
- Industrial robustness: Rated for −40 °C to 100 °C operation, supporting deployments in challenging thermal environments.
- Compact board-level footprint: 1152‑BBGA FCBGA packaging delivers a high pin count in a compact package suitable for dense PCB designs.
- Low-voltage core support: 870 mV to 930 mV core supply range aligns with modern power-rail designs for efficient system integration.
Why Choose 5SGXMA3K2F35I2WN?
The 5SGXMA3K2F35I2WN provides a robust balance of programmable logic capacity, embedded memory, and high I/O count in an industrial-grade Stratix V GX FPGA. Its specifications make it well suited to designs that require substantial on-chip resources, dense connectivity, and reliable operation across a wide temperature range.
For engineering teams building high-throughput communications hardware, data-plane accelerators, or complex industrial systems, this device offers a scalable hardware platform backed by the Stratix V GX family specifications and supported package options for compact, high-performance board designs.
Request a quote or submit a pricing inquiry to evaluate 5SGXMA3K2F35I2WN for your next design and to obtain availability and ordering information.

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