5SGXMA3K2F35I3N

The 5SGXMA3K2F35I3N is a Stratix® V GX Field Programmable Gate Array (FPGA) provided in a 1152-FBGA (35×35) FCBGA package for surface-mount applications. It delivers high logic density, large on-chip memory, and substantial I/O to address complex digital designs.

Key on-chip resources include 340,000 logic elements, approximately 19.456 Mbits of embedded memory, and 600 user I/Os. The device is rated for industrial temperature operation from −40 °C to 100 °C and is RoHS compliant.

Key Features

• Core Logic — 340,000 logic elements to implement large-scale, custom digital functions and datapaths.
• Embedded Memory — Approximately 19.456 Mbits of on-chip RAM for buffering, FIFOs, and state storage within the FPGA fabric.
• I/O Capacity — 600 I/Os to support complex multi-channel interfaces and high pin-count system integration.
• Package & Mounting — 1152-FBGA (35×35) FCBGA package, surface mount, suitable for compact board layouts.
• Power Supply — Core voltage range specified at 820 mV to 880 mV to match system power-rail design requirements.
• Temperature Grade — Industrial grade operation from −40 °C to 100 °C for temperature-tolerant applications.
• Standards & Compliance — RoHS compliant for regulatory and environmental compatibility.

Typical Applications

• High-density signal processing — Leverage 340,000 logic elements and embedded RAM to implement compute-intensive datapaths and custom accelerators.
• Large I/O systems — Use 600 user I/Os for multi-channel aggregation, board-level switching, or complex peripheral interfacing.
• Memory-heavy designs — Utilize approximately 19.456 Mbits of on-chip memory for buffering, packet queues, and stateful logic.
• Industrial control and automation — Industrial temperature rating (−40 °C to 100 °C) supports deployments in temperature-challenged environments.

Unique Advantages

• High logic density: 340,000 logic elements provide the capacity to consolidate multiple functions into a single FPGA, reducing board-level complexity.
• Substantial embedded memory: Approximately 19.456 Mbits of RAM enables large on-chip buffering and state storage without external memory dependencies.
• Extensive I/O availability: 600 user I/Os simplify interfacing to many peripherals and multiple high-speed channels on a single device.
• Industrial temperature operation: −40 °C to 100 °C rating supports robust operation across wide temperature ranges common in industrial deployments.
• Compact FCBGA packaging: 1152-FBGA (35×35) supports high integration density while remaining suitable for surface-mount assembly.
• Controlled core voltage range: 820 mV to 880 mV supply requirement helps align power delivery design and thermal planning.

Why Choose 5SGXMA3K2F35I3N?

The 5SGXMA3K2F35I3N combines high logic capacity, significant embedded memory, and a large I/O count in a compact FCBGA package, making it well suited for complex digital designs that require consolidation of multiple functions. Its industrial temperature rating and RoHS compliance make it appropriate for long-life, temperature-demanding applications.

Design teams seeking a high-density Stratix® V GX series device will find the clear, verifiable resource and power specifications beneficial for system-level planning, board layout, and thermal/power delivery considerations.

Request a quote or submit a procurement inquiry to obtain pricing, availability, and lead-time information for the 5SGXMA3K2F35I3N.