5SGXMA3K2F35I3LN

The 5SGXMA3K2F35I3LN is a Stratix V GX Field Programmable Gate Array (FPGA) device offering very high logic density and extensive I/O. This industrial-grade, surface-mount FPGA integrates 340,000 logic elements and approximately 19.456 Mbits of embedded memory to support complex digital designs.

Built for designs that require large amounts of programmable logic, significant on-chip RAM, and a high I/O count, the device operates across an extended temperature range and supports low-voltage core operation for modern system architectures.

Key Features

• High Logic Capacity  340,000 logic elements to implement large-scale custom logic, protocol stacks, and data-paths.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM to support buffering, FIFOs, and on-chip data storage.
• Extensive I/O  600 user I/O pins for dense external interfacing, peripheral connectivity, and board-level routing flexibility.
• Transceiver Speed Grades (series-level)  Stratix V GX devices include transceiver speed grade options documented in the device datasheet, covering multi-gigabit channel capabilities for high-speed serial links.
• Power and Voltage  Core supply voltage range of 820 mV to 880 mV for low-voltage core operation.
• Package & Mounting  1152-FBGA (35×35) supplier package / 1152-BBGA, FCBGA case; surface-mount package for compact PCB integration.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C, suitable for industrial and extended-temperature environments.
• Regulatory Compliance  RoHS-compliant for lead-free manufacturing and environmental compliance.

Typical Applications

• High-speed serial communications  Implementation of multi-gigabit serial links and protocol bridging using the Stratix V GX transceiver speed grades documented in the device family datasheet.
• Compute and data-path acceleration  Large programmable logic capacity and on-chip RAM make the device suitable for implementing custom accelerators, data-path processing, and packet handling.
• I/O-intensive system control  600 I/O pins support dense peripheral interfacing, board-level aggregation, and complex control plane implementations.
• Industrial and extended-temperature systems  Industrial grade and −40 °C to 100 °C operating range enable deployment in factory automation and other harsh environments.

Unique Advantages

• High logic integration: 340,000 logic elements reduce the need for external glue logic and enable consolidation of multiple functions into a single FPGA.
• Substantial on-chip memory: Approximately 19.456 Mbits of embedded RAM supports large buffers and on-chip data structures, improving latency and reducing external memory dependence.
• Large I/O footprint: 600 I/O pins give designers flexibility for parallel interfaces, multiple peripherals, and board-level routing options.
• Industrial temperature rating: Operation from −40 °C to 100 °C provides robustness for extended-temperature deployments.
• Low-voltage core operation: Core supply between 820 mV and 880 mV accommodates modern low-voltage power architectures.
• RoHS compliance: Conforms to RoHS requirements for environmentally conscious production.

Why Choose 5SGXMA3K2F35I3LN?

The 5SGXMA3K2F35I3LN positions itself as a high-density, industrial-grade Stratix V GX FPGA that combines substantial programmable logic, abundant on-chip RAM, and a high I/O count in a compact 1152-FBGA package. Its low-voltage core operation and extended temperature capability make it appropriate for demanding, I/O-rich designs that require on-board consolidation of complex functions.

This device is suited to engineering teams building systems that need scalability, significant internal buffering, and multi-gigabit serial link support as described in the Stratix V device documentation. The combination of capacity, I/O, and industrial thermal range delivers long-term design flexibility and robustness.

Request a quote or submit an RFQ for 5SGXMA3K2F35I3LN to begin procurement and integration planning.