5SGXMA3K2F35I2LN

The 5SGXMA3K2F35I2LN is a Stratix® V GX field programmable gate array (FPGA) in a 1152-ball BGA package, designed for industrial-temperature deployments. It provides a high logic capacity and extensive I/O count for complex digital systems requiring significant on-chip memory and interfacing.

As a member of the Stratix V family, this device targets designs that require large-scale programmable logic, abundant embedded RAM, and a broad I/O complement while meeting industrial operating temperature and RoHS compliance requirements.

Key Features

• Core Logic — Approximately 340,000 logic elements for large-scale custom logic implementation and complex system integration.
• Embedded Memory — Approximately 19.46 Mbits of on-chip RAM for buffering, packet processing, and state storage.
• I/O Density — Up to 600 I/O pins to support high-pin-count interfaces and extensive peripheral connectivity.
• Power Supply — Core voltage supply range of 820 mV to 880 mV for defined power budgeting and design planning.
• Package & Mounting — 1152-ball BGA package options are listed as 1152-BBGA and 1152-FBGA (35×35); surface-mount mounting type suitable for high-density PCB assembly.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C, suitable for industrial environments.
• Regulatory — RoHS compliant.

Typical Applications

• High-density digital processing — Use the large logic element count and embedded RAM for complex signal processing, compute offload, and protocol handling.
• High-pin-count interface hubs — Deploy in systems that require many parallel and serial interfaces, leveraging up to 600 I/O pins for connectivity.
• Industrial control and automation — Industrial temperature rating and surface-mount BGA packaging make the device suitable for robust factory and process-control equipment.
• Embedded system integration — Integrate custom logic, buffering, and glue logic on-chip to reduce external components and streamline board design.

Unique Advantages

• High logic capacity: Approximately 340,000 logic elements enable consolidation of multi-chip designs into a single FPGA, reducing system complexity.
• Substantial on-chip memory: Approximately 19.46 Mbits of embedded RAM supports large buffering and stateful operations without external memory.
• Extensive I/O support: Up to 600 I/O signals allow flexible interfacing to a wide range of peripherals and high-bandwidth buses.
• Industrial-grade operation: −40 °C to 100 °C operating range supports deployment in demanding environmental conditions.
• Compact, assembly-friendly package: 1152-ball BGA (35×35) surface-mount package enables high-density PCB designs and standard assembly processes.
• Standards-oriented compliance: RoHS compliance helps meet environmental and regulatory requirements for manufactured products.

Why Choose 5SGXMA3K2F35I2LN?

The 5SGXMA3K2F35I2LN combines high logic density, significant embedded memory, and a large I/O count in an industrial-temperature Stratix V GX FPGA package. It is well suited to engineers and procurement teams designing complex, high-pin-count systems that require an FPGA with sizeable on-chip resources and robust operating range.

As part of the Stratix V device family, this FPGA aligns with documentation and device-level specifications for designers who need to plan power, thermal, and I/O resources precisely. The combination of surface-mount BGA packaging and RoHS compliance supports modern manufacturing and regulatory needs.

Request a quote or submit an RFQ to procure 5SGXMA3K2F35I2LN for your next high-density FPGA design.