5SGXMA3K3F35C2LN

The 5SGXMA3K3F35C2LN is a Stratix® V GX field programmable gate array (FPGA) provided in a 1152-BBGA (FCBGA) package. It delivers high-density programmable logic, substantial on-chip memory, and a large I/O count for complex digital designs.

Designed for commercial applications, this device targets high-performance communication, signal processing, and system-integration tasks where large logic capacity, abundant embedded memory, and flexible I/O are required.

Key Features

• Logic Capacity  Approximately 340,000 logic elements to implement large-scale digital designs and complex custom logic.
• Embedded Memory  Approximately 19.5 Mbits of on-chip RAM for buffering, FIFOs, and intermediate data storage in compute and streaming applications.
• I/O Resources  Up to 600 general-purpose I/O pins to support dense external interfacing and multi-channel connectivity.
• Transceiver/Series Capabilities  Part of the Stratix V family; series documentation specifies GX transceiver speed grades (series-level) that support multi-gigabit channel operation as defined in the device datasheet.
• Power and Core Voltage  Core voltage supply range 820 mV to 880 mV, enabling designs that follow the device’s specified power rails.
• Package  1152-BBGA (FCBGA) package; supplier package listed as 1152-FBGA (35 × 35 mm) for high I/O density and compact board footprint.
• Operating Range  Commercial temperature grade with an operating temperature range of 0 °C to 85 °C.
• Compliance  RoHS compliant.

Typical Applications

• High‑performance networking and communications  Leverages the Stratix V family’s transceiver capabilities and high logic density for packet processing, line card, and protocol acceleration tasks.
• Signal processing and DSP  Large logic resources and ~19.5 Mbits of embedded memory support complex signal-chain implementations and real‑time processing.
• System integration and prototyping  600 I/O and the 1152-BBGA package allow dense peripheral connectivity for prototyping multi-board or mixed-signal systems.
• Commercial embedded systems  Commercial temperature rating (0 °C to 85 °C) aligns with a broad set of embedded applications requiring significant programmable logic and memory.

Unique Advantages

• High logic density: The device’s approximately 340,000 logic elements enable implementation of large, complex designs without immediate need for external logic.
• Substantial on-chip memory: Approximately 19.5 Mbits of embedded RAM reduce dependence on external memory for buffering and intermediate storage.
• Extensive I/O count: Up to 600 I/Os support multi-channel interfacing, parallel buses, and dense peripheral connections on compact PCBs.
• Compact, high-density packaging: The 1152-BBGA (35 × 35 mm) package balances high I/O and board area efficiency for space-constrained designs.
• Commercial readiness: Commercial temperature grade and RoHS compliance simplify integration into mainstream product designs and supply chains.
• Series-level transceiver capability: As a Stratix V GX device, the family’s documented transceiver speed grades support multi‑gigabit channel deployment where applicable per series datasheet.

Why Choose 5SGXMA3K3F35C2LN?

The 5SGXMA3K3F35C2LN combines large-scale programmable logic, substantial embedded memory, and a high I/O count in a compact 1152-BBGA package for commercial embedded and communications designs. Its voltage supply range and commercial temperature rating make it a fit for systems that require a dense, high-capacity FPGA while adhering to typical commercial operating conditions.

This device is suitable for design teams and integrators who need scalable logic capacity, significant on-chip RAM, and flexible interfacing in a single FPGA platform backed by the Stratix V family documentation.

Request a quote or submit an inquiry to receive pricing and availability for 5SGXMA3K3F35C2LN and to discuss how this Stratix V GX FPGA can meet your project requirements.