5SGXMA3K3F35C3N

The 5SGXMA3K3F35C3N is an Intel Stratix® V GX field programmable gate array supplied in a 1152-FBGA (35×35) package for surface-mount applications. It integrates a very large logic fabric and on-chip memory with high I/O density to address complex digital signal processing, networking, and high-performance compute tasks in commercial-grade designs.

Designed for applications that require substantial programmable logic, extensive embedded RAM, and many I/O channels, this device targets system designers seeking high integration and scalable implementation within a commercial temperature range.

Key Features

• Large logic capacity — 340,000 logic elements to implement complex custom logic, algorithms, and control functions.
• Logic block count — 128,300 logic blocks for structured resource allocation across designs.
• Embedded memory — approximately 19.46 Mbits of on-chip RAM for buffering, LUT storage, and data-intensive tasks.
• High I/O count — 600 user I/Os to support wide parallel interfaces, multi-channel connectivity, and dense board-level integration.
• Power supply range — core voltage supply specified from 820 mV to 880 mV, enabling defined power planning for the FPGA core.
• Package and mounting — 1152-BBGA / FCBGA (supplier package: 1152-FBGA 35×35) designed for surface-mount assembly on standard PCBs.
• Commercial temperature grade — rated for 0 °C to 85 °C operation for typical commercial environments.
• RoHS compliant — Pb-free, meeting RoHS environmental requirements for modern electronics manufacturing.

Typical Applications

• High-performance networking — Use the device's high logic density and large I/O complement to implement switching, packet processing, or custom protocol engines.
• Digital signal processing (DSP) — Leverage the large embedded RAM and extensive logic resources for real-time filtering, encoding/decoding, and data path acceleration.
• Compute and acceleration — Deploy as a programmable accelerator for algorithm offload, custom compute kernels, or specialized hardware functions within servers or appliances.

Unique Advantages

• Substantial programmable capacity: 340,000 logic elements enable implementation of large, multi-function designs without immediate need for partitioning across multiple devices.
• High on-chip memory: Approximately 19.46 Mbits of embedded RAM minimizes external memory dependence for many buffering and caching use cases.
• Dense I/O integration: 600 I/Os reduce the need for external multiplexing, simplifying board-level routing for multi-channel systems.
• Standard surface-mount package: 1152-FBGA (35×35) package supports established PCB manufacturing and assembly workflows.
• Commercial-grade operating range: Rated 0 °C to 85 °C to match a wide range of commercial electronics deployment scenarios.
• RoHS compliance: Meets environmental manufacturing requirements for modern product lines.

Why Choose 5SGXMA3K3F35C3N?

The 5SGXMA3K3F35C3N positions itself as a high-capacity, commercially rated Stratix V GX FPGA for designs that demand large programmable logic, substantial embedded memory, and broad I/O connectivity. Its combination of 340,000 logic elements, approximately 19.46 Mbits of RAM, and 600 I/Os supports sophisticated signal processing, protocol handling, and hardware acceleration use cases.

For development teams and procurement groups building commercial products, this device offers a balance of integration and predictable operating conditions, backed by Intel’s Stratix V documentation and ecosystem for design and deployment.

Request a quote or submit a pricing and availability inquiry to evaluate the 5SGXMA3K3F35C3N for your next high-capacity FPGA design.