5SGXMA3K3F35C4WN

The 5SGXMA3K3F35C4WN is a Stratix® V GX field programmable gate array (FPGA) IC from Intel, offered as a commercial-grade device. It provides a high logic density architecture with 340,000 logic elements and extensive on-chip memory, making it suitable for complex programmable logic designs that require large I/O counts and substantial embedded RAM.

Packaged in a 1152-BBGA (FCBGA) 35×35 mm supplier package and designed for surface-mount assembly, this device targets applications that demand significant integration of logic, memory, and I/O within a single FPGA footprint.

Key Features

• Core Logic — 340,000 logic elements provide substantial programmable logic resources for complex algorithms, parallel processing, and custom hardware acceleration.
• Embedded Memory — Approximately 19.46 Mbits of on-chip RAM to support data buffering, FIFOs, and memory-intensive logic functions.
• I/O Density — 600 general-purpose I/O pins to interface with high-channel-count systems and diverse peripheral sets.
• Power Supply — Core voltage specified at 820 mV to 880 mV, enabling low-voltage core operation in compliance with device requirements.
• Package & Mounting — 1152-BBGA FCBGA (supplier package: 1152-FBGA, 35×35 mm) designed for surface-mount PCB assembly to support compact, high-density board layouts.
• Operating Conditions — Commercial temperature grade with an operating range of 0 °C to 85 °C for standard commercial deployments.
• Compliance — RoHS compliant, meeting common environmental and lead-free regulatory requirements.

Typical Applications

• High-density logic systems — Implement complex state machines, datapath pipelines, and custom accelerators using the device's large logic element count and embedded memory.
• Multi‑channel I/O hubs — Leverage 600 I/Os to aggregate and route signals between numerous peripherals, sensors, or interface chips.
• Memory-backed buffering and interfacing — Use the approximately 19.46 Mbits of on-chip RAM for buffering, packet memory, or temporary data storage in streaming applications.

Unique Advantages

• High integration in a compact package: 340,000 logic elements and substantial embedded RAM in a 1152-BBGA footprint reduce board-level component count and simplify system architecture.
• Extensive I/O capacity: 600 I/Os enable dense external connectivity without resorting to multiple FPGAs or complex multiplexing schemes.
• Low-voltage core operation: Core supply specified between 820 mV and 880 mV supports designs that target modern low-voltage FPGA power domains.
• Commercial temperature suitability: Rated for 0 °C to 85 °C operation for standard commercial deployments and environments.
• RoHS compliant: Meets lead‑free and environmental compliance expectations for contemporary electronic products.

Why Choose 5SGXMA3K3F35C4WN?

The 5SGXMA3K3F35C4WN combines high logic density, significant embedded memory, and a large I/O count in a single commercial-grade Stratix V GX FPGA package. Its specification set is well suited to designers who need to consolidate complex digital functions, buffering, and high-channel connectivity into a compact surface-mount solution.

Built on the Stratix V family foundation and supplied by Intel, this device delivers the programmable resources and packaging options that support scalable designs and streamlined BOMs for mid- to high-complexity electronic systems.

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