5SGXMA3K3F35C4G

The 5SGXMA3K3F35C4G is a Stratix® V GX field-programmable gate array (FPGA) IC designed for high-density, high‑bandwidth digital designs. It combines a large logic fabric, substantial embedded RAM, and a high I/O count in a 1152-FBGA surface-mount package to address complex system integration requirements.

Targeted at commercial-temperature applications, this device delivers integration and scalability for designs that require significant on-chip logic, embedded memory and extensive I/O connectivity.

Key Features

• Core Logic  Approximately 340,000 logic elements for large-scale custom logic implementation and complex algorithm mapping.
• Embedded Memory  Approximately 19 Mbits of on-chip RAM to support large buffers, FIFOs and state storage without external memory.
• I/O Density  600 user I/Os to support wide parallel interfaces, dense board-level connectivity and multiple peripheral interfaces.
• Transceiver Capability  Part of the Stratix V GX family, which includes GX transceiver support described in the device series datasheet (see series documentation for supported transceiver speed grades).
• Power  Core voltage supply range specified at 820 mV to 880 mV to match system power-rail requirements for the device.
• Package & Mounting  1152-FBGA (35×35) package; surface-mount mounting type suitable for compact, high-density board designs.
• Temperature Grade  Commercial operating temperature range from 0 °C to 85 °C for standard commercial deployments.
• Environmental  RoHS compliant.

Typical Applications

• High-density digital processing  Implement large custom datapaths and parallel algorithms using the device’s extensive logic element count and embedded RAM.
• Multi-interface aggregation  Leverage 600 I/Os to consolidate multiple serial and parallel interfaces on a single FPGA for system consolidation.
• Prototyping and system validation  Ideal for complex prototypes requiring substantial on-chip resources and flexible I/O pinout in a surface-mount FBGA package.

Unique Advantages

• Highly integrated logic and memory: Combine approximately 340,000 logic elements with ~19 Mbits of embedded RAM to minimize reliance on external components and simplify board design.
• Extensive I/O capacity: 600 user I/Os enable direct connection to a wide range of peripherals and parallel interfaces without additional bridging devices.
• Compact, manufacturable package: 1152-FBGA (35×35) surface-mount package supports high-density PCB layouts while maintaining manufacturability.
• Commercial-temperature suitability: Rated for 0 °C to 85 °C operation for standard commercial deployments and environments.
• Low-voltage core operation: Core voltage supply range of 820–880 mV allows designers to align power architectures for efficient operation.
• RoHS compliance: Environmentally compliant for markets that require RoHS-conformant components.

Why Choose 5SGXMA3K3F35C4G?

The 5SGXMA3K3F35C4G delivers a balance of high logic capacity, substantial embedded memory and broad I/O resources in a compact 1152-FBGA package. It is well suited to commercial applications that demand high integration and flexible interface support while adhering to standard operating temperature ranges and RoHS environmental requirements.

Designers and system integrators seeking a scalable FPGA platform with significant on-chip resources and high I/O density will find this Stratix V GX device appropriate for complex custom logic, multi-interface aggregation and resource-intensive prototyping tasks.

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