5SGXMA3K3F35I3LG

The 5SGXMA3K3F35I3LG is a Stratix® V GX field programmable gate array (FPGA) in an industrial-grade, surface-mount 1152‑BBGA (FCBGA) package. It provides high logic density, substantial embedded memory, and an extensive I/O count for designs that require significant on‑chip resources and robust temperature performance.

Key electrical parameters include a core voltage supply range of 820 mV to 880 mV and an operating temperature range of –40 °C to 100 °C. The device is RoHS compliant and delivered in a 1152‑FBGA (35x35) supplier device package.

Key Features

• Core Capacity  340,000 logic elements for implementing large, complex programmable logic designs.
• Embedded Memory  Approximately 19.46 Mbits of on‑chip RAM for buffering, FIFO, and local data storage needs.
• I/O Density  600 user I/O pins to support wide parallel interfaces and multiple high‑pin-count peripherals.
• Package & Mounting  Surface‑mount 1152‑BBGA (FCBGA); supplier device package listed as 1152‑FBGA (35x35) for compact, high‑density board integration.
• Power  Core supply voltage range of 820 mV to 880 mV enabling defined low‑voltage core operation.
• Temperature Grade  Industrial grade with an operating range of –40 °C to 100 °C for extended environmental deployments.
• Compliance  RoHS compliant for environmental regulatory alignment.
• Stratix V GX Family Characteristics  Part of the Stratix V GX device family; device datasheet documents multiple transceiver and core speed grades available across the family.

Typical Applications

• High‑density digital processing  Use the device’s 340,000 logic elements and substantial on‑chip RAM for complex DSP pipelines, algorithm acceleration, and custom compute blocks.
• Multi‑interface systems  Large I/O count (600) supports protocol bridging, wide bus implementations, and multi‑lane connectivity without excessive external logic.
• Industrial control and automation  Industrial temperature rating (–40 °C to 100 °C) and robust packaging make the device suitable for factory and industrial environments requiring extended operating ranges.

Unique Advantages

• High programmable capacity: 340,000 logic elements enable consolidation of complex functions onto a single device, reducing board-level BOM and interconnect complexity.
• Significant on‑chip memory: Approximately 19.46 Mbits of embedded memory reduces reliance on external DRAM for many buffering and local storage tasks.
• Extensive I/O integration: 600 I/Os simplify system routing and support dense peripheral connectivity without multiple interface chips.
• Industrial‑grade thermal envelope: –40 °C to 100 °C operation supports deployments in challenging temperature environments.
• Defined low‑voltage core operation: 820 mV to 880 mV core supply range allows clear power budgeting for high‑performance FPGA designs.
• Regulatory alignment: RoHS compliance meets common environmental and manufacturing requirements.

Why Choose 5SGXMA3K3F35I3LG?

The 5SGXMA3K3F35I3LG positions itself as a high‑capacity, industrial‑grade Stratix V GX FPGA for designs that require large programmable logic, abundant on‑chip RAM, and a high I/O count in a compact BGA package. Its defined core voltage range and extended operating temperature make it suitable for systems where power architecture and environmental resilience are critical considerations.

Engineers designing high‑density processing, multi‑interface controllers, or industrial automation equipment will find the device’s combination of logic capacity, embedded memory, and I/O integration valuable for reducing component count and simplifying system architecture. Device details and family-level characteristics are documented in the Stratix V device datasheet for further electrical and switching specifications.

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