5SGXMA3K3F35C4N

The 5SGXMA3K3F35C4N is a Stratix V GX family Field Programmable Gate Array (FPGA) IC from Intel. It delivers high logic capacity and substantial on‑chip memory in a compact 1152‑BBGA FCBGA package, suited for designs that require large programmable fabric and extensive I/O in a commercial temperature range.

This device targets applications that need high logic density, significant embedded RAM, and many I/O pins while operating from a low core voltage (820 mV–880 mV) and standard commercial temperature conditions.

Key Features

• Logic Capacity  340,000 logic elements (logic cells) for complex, high‑density designs.
• Embedded Memory  Approximately 19.456 Mbits of on‑chip RAM to support buffering, look‑up tables, and on‑device data structures.
• I/O Resources  600 I/O pins providing broad external connectivity for high‑pin‑count interfaces and multi‑lane systems.
• Package & Mounting  1152‑BBGA FCBGA package (supplier device package: 1152‑FBGA, 35×35) with surface‑mount mounting type for dense board integration.
• Power  Core voltage supply range of 820 mV to 880 mV for the device core power domain.
• Temperature & Grade  Commercial grade device rated for 0 °C to 85 °C operating temperature.
• Compliance  RoHS compliant.

Typical Applications

• Network and Telecom Systems  High logic capacity and large I/O count enable packet processing, protocol bridging, and interface aggregation in communication equipment.
• Data Processing & Acceleration  Extensive logic fabric and embedded RAM support on‑device acceleration and custom data‑path implementations.
• Instrumentation and Test Equipment  Large I/O and programmable logic allow flexible front‑end control, data acquisition, and real‑time processing functions.
• Prototyping and Custom SoC Development  Use as a high‑capacity programmable platform for prototyping complex digital systems before ASIC implementation.

Unique Advantages

• High‑density programmable fabric: 340,000 logic elements provide the capacity needed for large, integrated designs without immediate ASIC commitment.
• Significant on‑chip RAM: Approximately 19.456 Mbits of embedded memory reduces reliance on external memory for many buffering and state‑storage tasks.
• Extensive external connectivity: 600 I/Os allow diverse peripheral support and wide interface routing options on a single device.
• Compact BGA footprint: 1152‑BBGA (35×35) package offers a balance of pin count and board area for dense system implementations.
• Low core voltage: 820 mV–880 mV core supply supports designs targeting lower core power domains.
• Commercial readiness: Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial environments.

Why Choose 5SGXMA3K3F35C4N?

The 5SGXMA3K3F35C4N combines large programmable logic capacity, substantial on‑chip RAM, and hundreds of I/Os in a single Stratix V GX device, making it suitable for complex, high‑density digital designs within commercial temperature limits. Its compact 1152‑BBGA package and low core voltage make it appropriate for densely populated boards where space and power domains are critical considerations.

As a member of the Stratix V GX family, this device is supported by Stratix V documentation and datasheets, providing the technical detail required to integrate the device into engineering designs and production plans.

Request a quote or submit a sales inquiry to evaluate 5SGXMA3K3F35C4N for your next high‑density FPGA design.