5SGXMA3K3F35C2WN

The 5SGXMA3K3F35C2WN is a Stratix V GX family Field Programmable Gate Array (FPGA) offered in a 1152‑BBGA (35×35) FCBGA package for surface‑mount applications. It provides high logic capacity, substantial on‑chip RAM, and a large I/O count to support dense, high‑functionality designs.

This device is suited for designs that require large programmable logic resources and extensive I/O connectivity while operating within a commercial temperature range (0 °C to 85 °C) and a core supply voltage range of 870 mV to 930 mV.

Key Features

• Core Logic Capacity 340,000 logic elements (cells) to implement complex digital functions and large-scale FPGA designs.
• Embedded Memory Approximately 19.456 Mbits of on‑chip RAM for buffering, FIFOs, and embedded data storage.
• High I/O Count 600 user I/O pins to support broad connectivity and multiple parallel interfaces.
• Package and Mounting 1152‑BBGA (1152‑FBGA, 35×35) FCBGA package; surface‑mount mounting type for modern board assembly.
• Power Supply Core voltage range of 870 mV to 930 mV for compatibility with targeted power architectures.
• Commercial Temperature Grade Rated for operation from 0 °C to 85 °C for commercial applications.
• Regulatory Compliance RoHS compliant, supporting lead‑free manufacturing processes.
• Family Transceiver Capability (Series Level) Stratix V GX family devices include transceiver speed grades (series documentation lists GX channel speed grades up to 14.1 Gbps), providing options for high‑speed serial connectivity at the family level.

Typical Applications

• High‑density networking equipment Use the large logic capacity and high I/O count to implement complex packet processing, switching fabrics, and interface aggregation.
• High‑performance communications Leverage the Stratix V GX family transceiver capabilities and abundant logic resources for PHY and protocol processing in communication systems.
• Signal processing and video Implement data‑intensive DSP pipelines and video processing engines using substantial on‑chip RAM and logic elements.
• Complex prototyping and SoC integration Integrate multiple functions and high‑pin‑count peripherals on a single FPGA platform during system development and validation.

Unique Advantages

• Large programmable fabric: 340,000 logic elements enable implementation of complex state machines, datapaths, and custom accelerators without external logic.
• Significant embedded memory: Approximately 19.456 Mbits of on‑chip RAM reduces dependence on external memory for many buffering and caching needs.
• Extensive I/O flexibility: 600 I/O pins provide the channel count and interface density required for multi‑lane and multi‑bus designs.
• Compact, industry‑grade package: 1152‑BBGA (35×35) packaging balances high pin density with board‑level manufacturability for surface‑mount assembly.
• Commercial operating range: Rated for 0 °C to 85 °C, aligning with a broad set of commercial and enterprise applications.
• RoHS compliance: Supports modern, lead‑free manufacturing and environmental standards.

Why Choose 5SGXMA3K3F35C2WN?

The 5SGXMA3K3F35C2WN delivers a combination of high logic density, substantial embedded memory, and a large I/O complement in a compact 1152‑BBGA package, making it well suited for complex commercial FPGA designs that demand on‑chip resources and flexible connectivity. Its power and thermal operating parameters and RoHS compliance support mainstream manufacturing and system integration.

Engineers and system architects seeking a Stratix V GX‑class device for dense logic implementation, heavy buffering, and high interface counts will find this part a practical choice for advanced communications, networking, signal processing, and prototyping applications.

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