5SGXMA3K3F40C2LN

The 5SGXMA3K3F40C2LN is a Stratix V GX family FPGA from Intel, supplied in a 1517-BBGA FCBGA package. It provides a high logic capacity device with a large embedded memory footprint and an extensive I/O count for designs that require significant on-chip resources.

Key device attributes include 340,000 logic elements, approximately 19.456 Mbits of embedded memory, and 600 I/O pins, with a commercial operating temperature range of 0 °C to 85 °C and a core voltage supply range of 820 mV to 880 mV.

Key Features

• Core Logic  340,000 logic elements for implementing large-scale custom digital logic and complex FPGA designs.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM to support buffering, state machines, and data-path storage.
• I/O Capacity  600 I/O pins to accommodate dense external connectivity and high fanout system interfaces.
• Package and Mounting  1517-BBGA (FCBGA) supplier device package listed as 1517-FBGA (40×40); surface-mount assembly compatible.
• Power  Core supply range from 820 mV to 880 mV for system power planning and voltage rail design.
• Temperature and Grade  Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Regulatory  RoHS compliant for environmental and material considerations.

Typical Applications

• High-density digital processing  Use the large logic and memory resources for complex algorithm implementation and custom accelerators.
• Multi-channel I/O systems  With 600 I/O pins, the device suits designs that require numerous parallel interfaces or dense external routing.
• Embedded system integration  Combine the on-chip memory and logic capacity to consolidate functions and reduce external component count.

Unique Advantages

• Substantial on-chip resources: 340,000 logic elements and ~19.456 Mbits of RAM reduce dependence on external logic and memory components.
• High I/O density: 600 I/O pins enable complex board-level connectivity and support for multi-channel designs.
• Compact FCBGA package: 1517-BBGA (1517-FBGA, 40×40) packaging supports high-density board layouts while using surface-mount assembly.
• Defined power envelope: A clear core voltage range (820 mV–880 mV) helps streamline power-rail design and validation.
• Commercial temperature rating: Operates across 0 °C to 85 °C for standard commercial applications and environments.
• RoHS compliant: Meets lead-free and restricted-substance requirements for regulated markets.

Why Choose 5SGXMA3K3F40C2LN?

The 5SGXMA3K3F40C2LN presents a high-capacity Stratix V GX FPGA option for designs that require a large quantity of logic elements, significant embedded memory, and extensive I/O. Its package and power specifications make it suitable for compact, resource-intensive commercial designs where on-chip integration reduces BOM complexity.

Manufactured by Intel and documented in the Stratix V family datasheet, this device is positioned for customers seeking a commercially graded FPGA with clearly defined electrical and thermal parameters for system integration and board-level planning.

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