5SGXMA3K3F40C2NCV

The 5SGXMA3K3F40C2NCV is a Stratix V GX field-programmable gate array (FPGA) in a 1517-BBGA FCBGA package designed for high-density, high-I/O applications. As a commercial-grade Stratix V GX device it delivers a large logic fabric and on-chip memory suitable for complex digital designs that require extensive I/O and embedded RAM resources.

Key Features

• Core Logic  Provides 340,000 logic elements to implement large-scale digital logic, custom processors, and complex state machines.
• Embedded Memory  Contains approximately 19.456 Mbits of on-chip RAM to support buffering, FIFOs, and on-chip data storage without external memory.
• High I/O Count  600 user I/O pins enable dense external connectivity for multi-channel interfaces, parallel data paths, and broad sensor/PHY attachments.
• Low-Voltage Core  Operates with a core supply voltage range of 870 mV to 930 mV, supporting low-voltage FPGA core domains.
• Commercial Temperature Grade  Rated for operation from 0°C to 85°C, suitable for commercial and controlled-environment systems.
• Package & Mounting  Supplied in a 1517-BBGA (1517-FBGA, 40×40) surface-mount package for compact board-level integration.
• Environmental Compliance  RoHS-compliant manufacturing to meet standard lead-free requirements.

Typical Applications

• High-density data processing  Large logic capacity and significant on-chip RAM enable aggregation and processing of parallel data streams.
• Multi-channel I/O systems  With 600 I/Os, the device is suited to designs that require broad external device interfacing or multi-lane connectivity.
• Complex control and prototyping  High logic element count supports advanced control algorithms, custom accelerators, and system prototyping.

Unique Advantages

• Large logic fabric: 340,000 logic elements provide capacity for feature-rich designs and system integration on a single device.
• Substantial embedded RAM: Approximately 19.456 Mbits of on-chip memory reduces dependence on external DRAM for many buffering and store-and-forward tasks.
• Extensive I/O availability: 600 I/Os enable flexible interfacing options and support complex multi-device connectivity without immediate need for external multiplexing.
• Compact BGA packaging: 1517-BBGA (1517-FBGA, 40×40) package allows high-density placement on PCBs while maintaining surface-mount assembly compatibility.
• Commercial-grade operation: 0°C to 85°C rating aligns the device with standard commercial deployments and environments.
• RoHS compliant: Meets common environmental and manufacturing lead-free requirements for modern electronics production.

Why Choose 5SGXMA3K3F40C2NCV?

The 5SGXMA3K3F40C2NCV combines a high logic element count, substantial on-chip RAM, and a large I/O complement in a compact BGA package—making it a practical choice for commercial systems that require dense logic integration and broad external connectivity. Its low-voltage core operation and RoHS compliance support contemporary board designs and manufacturing processes.

This device is appropriate for teams building advanced digital systems, multi-channel interfaces, or complex prototypes where on-chip resources and I/O capacity drive design decisions. The Stratix V GX family context provides an established platform for designs that need scalable FPGA resources and recognized device characteristics.

Request a quote or submit a procurement inquiry to get pricing and availability for the 5SGXMA3K3F40C2NCV and to discuss lead times and order quantities.