5SGXMA3K3F40C3NCV

The Intel Stratix® V GX FPGA 5SGXMA3K3F40C3NCV is a high-density programmable logic device that delivers substantial on-chip resources for complex digital designs. As a Stratix V GX family device, it provides large logic capacity, significant embedded memory, and extensive I/O connectivity in a compact FCBGA package.

This device is intended for commercial-temperature applications that require dense logic, abundant embedded RAM, and a high pin-count interface in a surface-mount form factor.

Key Features

• Logic Capacity — 340,000 logic elements to implement large-scale digital designs and complex algorithms.
• Embedded Memory — Approximately 19.5 Mbits of on-chip RAM to support data buffering, packet processing, and local storage.
• I/O Count — 600 user I/O pins for dense external connectivity and multi-channel interfacing.
• Package & Mounting — 1517-BBGA FCBGA package (supplier device package: 1517-FBGA, 40×40) with surface-mount construction for compact system integration.
• Power — Core supply range of 820 mV to 880 mV, enabling predictable power provisioning within specified limits.
• Operating Temperature — Commercial grade rated from 0 °C to 85 °C for standard commercial applications.
• Compliance — RoHS compliant to meet common environmental requirements.

Typical Applications

• High-density programmable logic designs — Use the device’s 340,000 logic elements and large embedded RAM to implement complex control, signal-processing, or algorithm-acceleration functions.
• Dense I/O systems — Deploy in systems that require many external interfaces or parallel data channels, leveraging the 600 I/O pins for broad connectivity.
• Embedded memory-intensive designs — Utilize approximately 19.5 Mbits of on-chip RAM for packet buffering, FIFO storage, and local data handling without immediate external memory needs.

Unique Advantages

• Large programmable fabric — 340,000 logic elements provide the headroom to consolidate multiple functions into a single FPGA, simplifying system architecture.
• Significant on-chip RAM — Approximately 19.5 Mbits of embedded memory reduces reliance on external memory for many buffering and caching tasks.
• High I/O density — 600 I/O pins enable complex multi-channel interfaces and flexible board-level connectivity.
• Compact, surface-mount FCBGA package — 1517-BBGA (40×40) package saves board area while supporting high pin counts for dense integration.
• Commercial temperature rating — Rated 0 °C to 85 °C for reliable operation within standard commercial environments.
• Regulatory compliance — RoHS compliant to support common environmental and manufacturing requirements.

Why Choose 5SGXMA3K3F40C3NCV?

The 5SGXMA3K3F40C3NCV combines large logic density, substantial embedded RAM, and a high I/O count in a compact FCBGA surface-mount package, making it well suited for commercial designs that demand integrated, high-capacity programmable logic. Its specified core supply range and commercial temperature rating offer predictable integration into standard power and thermal designs.

Choosing this Stratix® V GX device provides a scalable platform for consolidating functions, reducing external components, and enabling dense I/O implementations while maintaining compliance with RoHS requirements.

Request a quote or submit an inquiry for 5SGXMA3K3F40C3NCV to discuss availability and pricing for your design needs.