5SGXMA3K3F40C4N

IC FPGA 600 I/O 1517FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 19456000 340000 1517-BBGA, FCBGA

Quantity 760 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1517-BBGA, FCBGANumber of I/O600Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs128300Number of Logic Elements/Cells340000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits19456000

Overview of 5SGXMA3K3F40C4N – Stratix V GX FPGA, 340,000 logic elements, ~19.46 Mbits RAM, 600 I/O

The 5SGXMA3K3F40C4N is a Stratix® V GX field programmable gate array (FPGA) from Intel (Altera). It delivers high logic density and substantial on-chip memory in a 1517-BBGA FCBGA package for surface-mount applications.

Designed for commercial-temperature designs, this device targets high-density digital systems that require many logic elements, abundant embedded memory, and a large number of I/O connections, while operating at a low core voltage range.

Key Features

  • Core Logic  Approximately 340,000 logic elements, providing capacity for large, complex digital designs.
  • Embedded Memory  Approximately 19.456 Mbits of on-chip RAM for buffering, packet memory, and intermediate storage.
  • I/O Density  Up to 600 I/O pins to support high-pin-count interfaces and multi-channel systems.
  • Power and Voltage  Core supply voltage specified at 820 mV to 880 mV, enabling low-voltage core operation.
  • Package & Mounting  1517-BBGA (FCBGA) package; supplier device package listed as 1517-FBGA (40×40). Surface mount mounting type.
  • Temperature Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
  • Standards & Compliance  RoHS compliant.

Typical Applications

  • High-density digital logic  Implement large-scale combinational and sequential logic using the device’s ~340,000 logic elements.
  • Memory-intensive accelerators  On-chip RAM (approximately 19.456 Mbits) supports buffering and data-path storage for compute or streaming tasks.
  • I/O-rich systems  Up to 600 I/Os allow integration with multiple interfaces, peripherals, and multi-lane front-end electronics.

Unique Advantages

  • High logic capacity: Supports complex designs and feature consolidation with approximately 340,000 logic elements.
  • Substantial embedded RAM: Approximately 19.456 Mbits of on-chip memory reduces reliance on external memory for many designs.
  • Large I/O availability: 600 I/O pins enable dense external connectivity and multiple interface channels.
  • Low core voltage operation: Specified 820 mV–880 mV core supply supports low-voltage system architectures.
  • Commercial-grade reliability: Rated for 0 °C to 85 °C operation for standard commercial applications.
  • RoHS compliant: Meets environmental compliance requirements for lead-free assembly.

Why Choose 5SGXMA3K3F40C4N?

The 5SGXMA3K3F40C4N combines very high logic density, substantial on-chip RAM, and extensive I/O capability in a compact 1517-BBGA FCBGA package, making it suitable for designers who need to integrate large digital subsystems while minimizing external components. Its commercial temperature rating and RoHS compliance make it appropriate for mainstream embedded and communications applications that operate within 0 °C to 85 °C.

Choose this Stratix V GX device when your design requires significant logic resources and embedded memory alongside a high pin-count interface, and when you need a packaged surface-mount FPGA solution with documented electrical characteristics and operating conditions.

Request a quote or submit a purchase inquiry to obtain pricing, availability, and lead-time information for the 5SGXMA3K3F40C4N.

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