5SGXMA3K3F40C3G

The 5SGXMA3K3F40C3G is a Stratix® V GX Field Programmable Gate Array (FPGA) IC that delivers high on-chip logic density and memory capacity in a ball-grid array package. The device integrates 340,000 logic elements, approximately 19.456 Mbits of embedded memory, and up to 600 I/Os with a low-voltage core supply in a 1517-BBGA (1517-FBGA, 40×40) surface-mount package.

Rated for commercial temperature operation (0 °C to 85 °C) and RoHS compliant, this FPGA is specified with a core supply range of 0.820 V to 0.880 V, offering a combination of density, I/O capacity, and power characteristics for complex digital designs.

Key Features

• Core Logic — 340,000 logic elements provide substantial programmable fabric for implementing large-scale digital logic and custom processing functions.
• Embedded Memory — Approximately 19.456 Mbits of on-chip RAM to support large buffering, state storage, and memory-intensive logic blocks.
• I/O Capacity — Up to 600 I/Os to accommodate extensive peripheral, bus, and interface connectivity directly from the device.
• Power Supply — Core voltage specified at 820 mV to 880 mV (0.820–0.880 V), enabling low-voltage core operation aligned with the device family requirements.
• Package & Mounting — 1517-BBGA, FCBGA package (supplier package: 1517-FBGA, 40×40) in a surface-mount form factor for PCB integration.
• Temperature & Grade — Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Standards Compliance — RoHS compliant to support current environmental and manufacturing requirements.

Unique Advantages

• High logic density: 340,000 logic elements enable consolidation of complex functions into a single FPGA, reducing board-level component count.
• Large on-chip memory: Approximately 19.456 Mbits of embedded RAM helps minimize external memory dependency for buffering and state storage.
• Extensive I/O connectivity: Up to 600 I/Os allow direct interfacing to a wide array of peripherals and system buses without additional I/O expanders.
• Low-voltage core operation: Specified 0.820–0.880 V core supply supports modern low-voltage system architectures and power budgeting.
• Commercial temperature rating: 0 °C to 85 °C operational range suitable for a broad set of commercial and enterprise applications.
• RoHS compliant packaging: Surface-mount 1517-BBGA (1517-FBGA, 40×40) format simplifies assembly and meets environmental standards.

Why Choose 5SGXMA3K3F40C3G?

The 5SGXMA3K3F40C3G positions itself as a high-density Stratix V GX FPGA option where substantial logic capacity, significant on-chip memory, and a high count of I/Os are required in a single, surface-mount package. Its low-voltage core supply and commercial temperature grade make it suitable for demanding commercial designs that require substantial programmable resources while adhering to environmental compliance.

For engineering teams designing complex digital systems that need to consolidate logic, on-chip RAM, and I/O connectivity into a compact FPGA form factor, this device offers a clear specification-driven basis for selection and integration.

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