5SGXMA3K3F40C2G

The 5SGXMA3K3F40C2G is a Stratix V GX field-programmable gate array (FPGA) IC from Intel, offering high logic density and a large on-chip memory footprint for complex, high‑integration designs. It provides a combination of substantial logic resources and a high I/O count suitable for demanding digital, signal-processing, and communications applications.

This device is supplied in a 1517‑BBGA (1517‑FBGA 40×40) FCBGA package for surface-mount assembly and is specified for commercial operation from 0 °C to 85 °C with a core voltage supply range of 870 mV to 930 mV.

Key Features

• Core Capacity  Approximately 340,000 logic elements to implement large-scale digital designs and complex state machines.
• Embedded Memory  Approximately 19.5 Mbits of on-chip RAM for buffering, embedded data structures, and local storage.
• I/O Density  600 I/O pins to support multi-channel interfacing, high-pin-count peripherals, and dense system connectivity.
• Package & Mounting  1517‑BBGA (1517‑FBGA 40×40) FCBGA, surface-mount package delivering high pin density in a compact footprint.
• Power  Core supply voltage in the range of 870 mV to 930 mV for low‑voltage system integration.
• Operating Range & Grade  Commercial grade device rated for 0 °C to 85 °C operation.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Networking & Communications  High I/O count and large embedded memory make this FPGA suitable for packet processing, protocol handling, and dense interface aggregation.
• Data Center Acceleration  Substantial logic resources and on-chip RAM support custom compute accelerators and buffering in server and appliance designs.
• Signal Processing & Instrumentation  Large logic capacity and embedded memory enable streaming DSP, real‑time processing, and instrumentation control functions.
• System Prototyping & Integration  High-density programmable logic for developing and validating complex system-on-board designs with many external interfaces.

Unique Advantages

• High logic integration: Deploy complex algorithms and large state machines on approximately 340,000 logic elements, reducing multi‑device count.
• Substantial on-chip RAM: Approximately 19.5 Mbits of embedded memory reduces dependence on external memory for many buffering and storage tasks.
• Extensive I/O capability: 600 I/O pins enable diverse interface combinations and dense system connectivity without external multiplexing.
• Compact, high‑pin package: The 1517‑BBGA FCBGA (1517‑FBGA 40×40) provides a high pin count in a space-efficient surface‑mount form factor.
• Low-voltage core: 870–930 mV supply range aligns with low-voltage FPGA core architectures for power-optimized designs.
• Commercial grade and compliant: Rated for 0 °C to 85 °C operation and RoHS compliant for mainstream electronic products.

Why Choose 5SGXMA3K3F40C2G?

The 5SGXMA3K3F40C2G brings the Stratix V GX family’s high-density logic and sizeable on-chip memory into a compact FCBGA package, addressing applications that demand substantial programmable resources and extensive I/O. Its specification for commercial temperature ranges and low-voltage core operation makes it suitable for many enterprise, communications, and instrumentation designs.

Backed by Intel’s Stratix V device documentation, this device is appropriate for engineering teams building scalable FPGA-based subsystems that require documented electrical characteristics, dense integration, and a high I/O count.

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