5SGXMA3K3F35I4WN

The 5SGXMA3K3F35I4WN is a Stratix V GX FPGA from Intel designed for high-density programmable logic applications. It combines a large logic fabric, substantial embedded RAM, and extensive I/O in a 1152-BBGA FCBGA package for industrial-grade deployments.

Targeted at designs that require significant on-chip resources and wide I/O, this device operates on a low-voltage core supply and supports industrial temperature operation for robust system-level integration.

Key Features

• High Logic Density — 340000 logic elements to implement complex custom logic and hardware acceleration.
• Embedded Memory — approximately 19.456 Mbits of on-chip RAM for buffering, state storage, and local data handling.
• Large I/O Count — 600 user I/O pins to support dense peripheral and interface connectivity.
• Package and Mounting — 1152-BBGA, FCBGA package; supplier device package listed as 1152-FBGA (35×35); surface-mount mount type.
• Core Voltage — voltage supply range 820 mV to 880 mV for core power planning.
• Industrial Temperature Grade — rated operating temperature from −40°C to 100°C for extended-environment use.
• Series Transceiver Capability — Stratix V GX family datasheet documents transceiver speed grades (for the series) including GX channel options such as 14.1 Gbps, 12.5 Gbps, and 8.5 Gbps.
• Regulatory Compliance — RoHS compliant.

Typical Applications

• High-density programmable logic — implement complex custom logic, hardware accelerators, and large-scale state machines using the device's 340000 logic elements and embedded RAM.
• Systems with extensive peripheral interfaces — leverage 600 I/O pins for multi-channel data acquisition, control planes, or dense front-panel I/O.
• Industrial and extended-temperature designs — deploy in equipment requiring −40°C to 100°C operating range where industrial-grade components are specified.
• Designs requiring low-voltage core operation — integrate into systems designed around a core supply of 820–880 mV.

Unique Advantages

• High on-chip resource density: 340000 logic elements and approximately 19.456 Mbits of embedded RAM provide the capacity for large, integrated designs without excessive external logic.
• Extensive I/O: 600 I/O pins simplify board-level routing for multi-interface systems and reduce the need for external multiplexing.
• Industrial-grade reliability: Rated for −40°C to 100°C operation to meet extended-environment requirements.
• Low-voltage core support: 820–880 mV core voltage range allows alignment with low-voltage power architectures.
• Robust package options: 1152-BBGA (1152-FBGA supplier package) provides a compact, surface-mount form factor for high-density PCB designs.
• Stratix V GX series capabilities: Series-level transceiver speed grades are documented in the Stratix V GX datasheet, providing options for designs that require high-speed serial connectivity.

Why Choose 5SGXMA3K3F35I4WN?

This Stratix V GX FPGA delivers a combination of high logic density, substantial embedded memory, and a large I/O count in a compact surface-mount BBGA package rated for industrial temperatures. It is well suited to customers building complex, resource-intensive FPGA designs that require many I/Os and reliable operation across extended temperature ranges.

As a member of the Intel Stratix V GX family, the device benefits from documented series-level capabilities and manufacturer support, making it a suitable choice for engineering teams focused on scalable, long-lived hardware platforms.

Request a quote or submit a procurement inquiry for pricing and availability to move your design forward with the 5SGXMA3K3F35I4WN Stratix V GX FPGA.