5SGXMA3K3F40I4G

The 5SGXMA3K3F40I4G is a Stratix® V GX field programmable gate array (FPGA) IC from Intel, offered in an industrial temperature grade and a 1517-BBGA FCBGA package. This device combines high logic density, substantial on-chip memory, and a large I/O count to address complex, connectivity‑heavy designs.

Designed for applications that require dense programmable logic, abundant embedded RAM, and broad peripheral connectivity, the device targets industrial systems and other applications that benefit from high logic capacity and robust operating range.

Key Features

• Core Logic  128,300 LABs (logic array blocks) delivering 340,000 logic elements for implementing large-scale digital designs.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM to support buffering, LUT‑based functions, and local storage.
• I/O Capacity  600 user I/O pins to accommodate extensive external interfaces and multi‑lane connectivity.
• Transceiver Family Details  Stratix V GX family transceiver speed grading is documented in the device series datasheet, supporting high‑speed serial channels (series information in manufacturer documentation).
• Power  Core voltage supply range of 820 mV to 880 mV for the device core power domain.
• Package & Mounting  1517‑BBGA FCBGA (supplier package: 1517‑FBGA, 40 × 40) in a surface‑mount form factor for high‑density PCBs.
• Temperature & Grade  Industrial grade with an operating temperature range of −40 °C to 100 °C.
• Compliance  RoHS‑compliant manufacturing status.

Typical Applications

• Industrial Control & Automation  Implement complex control logic, state machines, and real‑time processing using high logic density and abundant I/O for sensor and actuator interfaces.
• High‑density Digital Signal Processing  Use embedded RAM and large logic fabric for buffering, filtering, and custom DSP pipelines.
• Networking & Communications Equipment  Leverage Stratix V GX series transceiver capabilities (documented in the series datasheet) alongside 600 I/Os for packet processing, protocol offload, and interface aggregation.

Unique Advantages

• High logic capacity: 340,000 logic elements enable integration of large, complex designs into a single device, reducing board count and interconnect complexity.
• Substantial on‑chip memory: Approximately 19.456 Mbits of embedded RAM supports local buffering and high‑throughput data paths without external memory for many use cases.
• Extensive I/O: 600 I/O pins provide the flexibility to interface with numerous peripherals, transceivers, and mezzanine modules.
• Industrial temperature range: Rated from −40 °C to 100 °C for deployment in temperature‑challenging environments.
• Compact, PCB‑friendly package: 1517‑BBGA FCBGA (40 × 40) surface‑mount package supports high‑density PCB layouts while keeping a small system footprint.
• Low‑voltage core operation: 820 mV to 880 mV core supply supports contemporary low‑voltage FPGA power domains.

Why Choose 5SGXMA3K3F40I4G?

The 5SGXMA3K3F40I4G positions itself as a high‑capacity Stratix V GX FPGA for industrial and other demanding applications that require a combination of large logic resources, significant on‑chip memory, and extensive I/O. Its industrial temperature rating and FCBGA packaging make it suitable for compact, rugged system designs.

Backed by Intel's Stratix V device documentation, this device is appropriate for engineers and system designers who need scalable FPGA resources and documented series‑level transceiver performance to implement sophisticated custom logic, high‑speed interfaces, and memory‑intensive functions.

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