5SGXMA3K3F40I3NCV

IC FPGA 600 I/O 1517FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 19456000 340000 1517-BBGA, FCBGA

Quantity 403 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O600Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs128300Number of Logic Elements/Cells340000
Number of GatesN/AECCNOBSOLETEHTS CodeN/A
QualificationN/ATotal RAM Bits19456000

Overview of 5SGXMA3K3F40I3NCV – Stratix® V GX Field Programmable Gate Array (FPGA) IC

The 5SGXMA3K3F40I3NCV is a Stratix® V GX FPGA in a 1517‑BBGA (1517‑FBGA, 40×40) surface‑mount package, offered in an industrial temperature grade. It delivers very high logic density, abundant embedded memory, and a large I/O count for demanding programmable‑logic applications.

Designed for applications that require large programmable fabric and robust I/O, this device combines approximately 340,000 logic elements with roughly 19.46 Mbits of on‑chip RAM and 600 I/Os, operating over an industrial temperature range and a core voltage supply range of 820 mV to 880 mV.

Key Features

  • Programmable Fabric  Approximately 340,000 logic elements provide extensive resources for complex logic implementation and high‑density designs.
  • Embedded Memory  Approximately 19.46 Mbits of on‑chip RAM support large buffering, FIFOs, and memory‑intensive algorithms without external memory dependency.
  • I/O Capacity  600 programmable I/Os enable broad peripheral interfacing and high‑pin‑count system integration.
  • Transceiver Capability (Series)  As a Stratix V GX family device, the series supports multiple transceiver speed grades (family datasheet lists GX channel speed grades up to 14.1 Gbps), enabling high‑speed serial connectivity where required.
  • Power Supply  Core operating supply range specified at 820 mV to 880 mV, enabling precise power budgeting for system designs.
  • Industrial Temperature Range  Rated for operation from −40 °C to 100 °C, suitable for industrial environments and temperature‑sensitive deployments.
  • Package and Mounting  1517‑BBGA (1517‑FBGA, 40×40) FCBGA package with surface‑mount mounting for compact, high‑density board implementations.
  • Compliance  RoHS‑compliant construction supports regulatory and environmental requirements.

Typical Applications

  • High‑density logic designs  Large programmable fabric and abundant embedded RAM make this device suitable for complex FPGA implementations and custom accelerators.
  • High‑speed serial connectivity  Stratix V GX family transceiver speed grades support high‑bandwidth serial links for networking and data transport applications.
  • Industrial systems  Industrial temperature rating and high I/O count enable deployment in control, automation, and rugged embedded systems.
  • Signal processing and instrumentation  Large logic capacity and on‑chip memory support real‑time processing, buffering, and custom DSP pipelines.

Unique Advantages

  • High logic and memory integration: Combines approximately 340,000 logic elements with ~19.46 Mbits of embedded RAM to minimize reliance on external components.
  • Extensive I/O count: 600 I/Os allow direct connection to numerous peripherals, sensors, and high‑speed interfaces, simplifying board design.
  • Industrial robustness: −40 °C to 100 °C operating range and industrial grade labeling support reliable operation in demanding environments.
  • Configurable high‑speed serial support: Stratix V GX series transceiver speed grades (as documented in the family datasheet) provide options for high‑bandwidth serial links when needed.
  • Compact, surface‑mount packaging: 1517‑BBGA FCBGA (40×40) package balances high I/O and density with board‑space efficiency.
  • Regulatory compliance: RoHS compliance supports environmental and manufacturing requirements.

Why Choose 5SGXMA3K3F40I3NCV?

The 5SGXMA3K3F40I3NCV places substantial programmable resources, embedded memory, and a large I/O complement into a compact FCBGA package rated for industrial temperatures. It is positioned for engineers and system designers who need high logic density, significant on‑chip RAM, and options for high‑speed serial connectivity within a ruggedized operating envelope.

Choose this Stratix® V GX device when your designs demand scalable logic capacity, broad interfacing capability, and the thermal and electrical specifications that support industrial deployments. The device’s integration level helps reduce external BOM and simplifies board-level integration while aligning to RoHS environmental requirements.

Request a quote or submit a product inquiry to obtain pricing, lead time, and availability for the 5SGXMA3K3F40I3NCV. Our team can provide technical sales documentation and support tailored to your project requirements.

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