5SGXMA3K3F40I4N

The 5SGXMA3K3F40I4N is an Intel Stratix V GX family FPGA offering high on-chip logic density and extensive I/O capability in a 1517-BBGA FCBGA package. It is provided in an industrial temperature grade and is designed for applications that require large-scale programmable logic, significant embedded memory, and wide I/O count.

With approximately 340,000 logic elements, roughly 19.456 Mbits of embedded memory, and 600 I/Os, this device targets complex digital systems where integration, configurable logic, and robust operating range are required.

Key Features

• Core Logic — Approximately 340,000 logic elements for implementing large, complex FPGA designs and custom digital architectures.
• Embedded Memory — Approximately 19.456 Mbits of on-chip RAM to support large buffers, FIFOs, and on-chip data storage for high-throughput processing.
• I/O Capacity — 600 user I/O pins to support dense external interfacing and multi-channel connectivity.
• Package & Mounting — 1517-BBGA (FCBGA) package; supplier device package listed as 1517-FBGA (40×40). Surface-mount device suitable for standard PCB assembly.
• Power — Core voltage supply range from 820 mV to 880 mV, enabling defined core power budgeting during system design.
• Temperature & Grade — Industrial grade with an operating temperature range of –40 °C to 100 °C for deployment in extended-temperature environments.
• RoHS Compliance — Device is RoHS compliant for environmental regulatory requirements.

Typical Applications

• High-density digital processing — Use the ~340,000 logic elements and large embedded memory to implement complex signal processing, protocol stacks, or algorithm accelerators.
• Multi-channel I/O systems — 600 I/Os enable aggregation of many parallel interfaces for data acquisition, switching, or board-level bridging applications.
• Industrial control and instrumentation — Industrial-grade temperature range and surface-mount packaging support deployment in factory automation and test equipment with demanding environmental requirements.

Unique Advantages

• High logic density: Approximately 340,000 logic elements reduce the need to partition designs across multiple devices and simplify system-level architecture.
• Significant on-chip RAM: Approximately 19.456 Mbits of embedded memory enables large on-chip buffering and reduces external memory dependency.
• Extensive I/O: 600 I/Os support high fanout and complex connectivity requirements without additional interface devices.
• Industrial operating range: Rated for –40 °C to 100 °C operation, offering suitability for extended-temperature environments.
• Compact FCBGA packaging: 1517-BBGA (1517-FBGA, 40×40) package provides a high-pin-count, board-efficient footprint for dense system designs.
• Regulatory compliance: RoHS compliance helps meet environmental and supply-chain requirements.

Why Choose 5SGXMA3K3F40I4N?

The 5SGXMA3K3F40I4N delivers a combination of large programmable logic capacity, substantial embedded memory, and very high I/O density in an industrial-grade Stratix V GX FPGA. These characteristics make it well suited for engineers designing high-performance, highly integrated digital systems that require on-chip resources and robust environmental tolerance.

As a Stratix V GX device from Intel, it aligns with established device documentation and family-level options for designers who need scalable FPGA resources and predictable electrical and thermal parameters. The device’s package, power, and temperature specifications provide a clear basis for system-level planning and BOM decisions.

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