5SGXMA4H2F35C2N

The 5SGXMA4H2F35C2N is a Stratix V GX FPGA from Intel (Altera), offered as a commercial-grade, surface-mount device. It delivers high logic density and substantial embedded memory for complex digital designs that require extensive on-chip resources and high I/O counts.

This device is targeted at applications that benefit from large-scale programmable logic, abundant embedded RAM, and a high number of user I/O signals, providing designers with the integration and configurability needed for demanding system-level implementations.

Key Features

• Core Logic: 420,000 logic elements, enabling implementation of large and complex logic networks directly on-chip.
• Embedded Memory: Approximately 37.9 Mbits of on-chip RAM for buffering, lookup tables, and local data storage.
• I/O Capacity: 600 user I/O pins to support wide parallel interfaces, multi-channel connectivity, and dense system integration.
• Package & Mounting: 1152-BBGA (FCBGA) package; supplier device package listed as 1152-FBGA (35×35). Surface-mount design suitable for modern PCB assembly flows.
• Power Supply: Core voltage operating range from 870 mV to 930 mV, allowing precise power budgeting and design alignment with system rails.
• Commercial Temperature Rating: Rated for operation from 0° to 85°C, matching commercial-grade system environments.
• Compliance: RoHS compliant, supporting regulatory and environmental requirements for lead-free assemblies.

Typical Applications

• High-density signal processing: Large logic capacity and substantial embedded RAM make the device suitable for DSP pipelines, video processing, and algorithm acceleration implemented in programmable logic.
• Communications and networking: High I/O count and Stratix V GX family attributes support multi-channel interfaces and dense protocol implementations.
• Prototype and system integration: Ample programmable resources enable complex system prototypes and integration of custom accelerators or control logic.
• Test, measurement, and instrumentation: Large on-chip memory and many I/Os facilitate high-channel-count data capture, pre-processing, and deterministic logic control.

Unique Advantages

• High logic density: 420,000 logic elements reduce the need for multiple devices, simplifying board-level design and lowering BOM complexity.
• Substantial on-chip memory: Approximately 37.9 Mbits of embedded RAM provides local storage for buffering and stateful computations, improving throughput and latency.
• Extensive I/O availability: 600 I/Os enable flexible interfacing to peripherals, high-channel-count systems, and wide buses without external multiplexing.
• Commercial-grade thermal range: Rated 0°–85°C for reliable operation in standard commercial environments.
• RoHS compliance: Meets lead-free environmental standards for regulatory alignment on assembled products.

Why Choose 5SGXMA4H2F35C2N?

The 5SGXMA4H2F35C2N combines large-scale programmable logic with significant embedded memory and a high I/O count in a compact 1152-ball FBGA package. Its commercial temperature rating and RoHS compliance make it appropriate for a broad range of commercial electronic systems where on-chip integration and configurability reduce board-level complexity.

This device is well suited to design teams needing scalable programmable resources for signal processing, communications, prototyping, and instrumentation tasks. Its feature set supports long-term design flexibility and integration across evolving product requirements.

If you would like pricing, availability, or a formal quote for the 5SGXMA4H2F35C2N, submit a request or inquire with sales to begin the procurement process.